The thermoelectric properties of 54 different group 4 half-Heusler (HH) alloys have been studied from first principles. Electronic transport was studied with density functional theory using hybrid functionals facilitated by the method, while the temperature-dependent effective potential method was used for the phonon contributions to the figure of merit . The phonon thermal conductivity was calculated including anharmonic phonon-phonon, isotope, alloy, and grain-boundary scattering. HH alloys have an XYZ composition, and those studied here are in the group 4-9-15 (Ti,Zr,Hf)(Co,Rh,Ir)(As,Sb,Bi) and group 4-10-14 (Ti,Zr,Hf)(Ni,Pd,Pt)(Ge,Sn,Pb). The electronic part of the thermal conductivity was found to significantly impact and thus the optimal doping level. Furthermore, the choice of functional was found to significantly affect thermoelectric properties, particularly for structures exhibiting band alignment features. The intrinsic thermal conductivity was significantly reduced when alloy and grain-boundary scattering were accounted for, which also reduced the spread in thermal conductivity. It was found that sublattice disorder on the -site, i.e., the site occupied by group 14 or 15 elements, was more effective than -site substitution, occupied by group 4 elements. The calculations confirmed that ZrNiSn, ZrCoSb, and ZrCoBi based alloys display promising thermoelectric properties. A few other n-type and p-type compounds were also predicted to be potentially excellent thermoelectric materials, given that sufficiently high charge carrier concentrations can be achieved. This study provides insight into the thermoelectric potential of HH alloys and casts light on strategies to optimize the thermoelectric performance of multicomponent alloys.
Skip Nav Destination
Article navigation
14 October 2019
Research Article|
October 08 2019
Thermoelectric transport trends in group 4 half-Heusler alloys
Special Collection:
Advanced Thermoelectrics
Kristian Berland
;
Kristian Berland
a)
1
Faculty of Science and Technology, Norwegian University of Life Sciences
, NO-1432 Ås, Norway
2
Centre for Materials Science and Nanotechnology, Department of Physics, University of Oslo
, NO-0316 Oslo, Norway
Search for other works by this author on:
Nina Shulumba
;
Nina Shulumba
3
Department of Applied Physics and Materials Science, California Institute of Technology
, Pasadena, California 91125, USA
Search for other works by this author on:
Olle Hellman
;
Olle Hellman
3
Department of Applied Physics and Materials Science, California Institute of Technology
, Pasadena, California 91125, USA
Search for other works by this author on:
Clas Persson
;
Clas Persson
2
Centre for Materials Science and Nanotechnology, Department of Physics, University of Oslo
, NO-0316 Oslo, Norway
Search for other works by this author on:
Ole Martin Løvvik
Ole Martin Løvvik
2
Centre for Materials Science and Nanotechnology, Department of Physics, University of Oslo
, NO-0316 Oslo, Norway
4
Materials Physics, SINTEF
, NO-0314 Oslo, Norway
Search for other works by this author on:
a)
Email: kristian.berland@nmbu.no
Note: This paper is part of the special topic on Advanced Thermoelectrics.
J. Appl. Phys. 126, 145102 (2019)
Article history
Received:
July 29 2019
Accepted:
September 21 2019
Citation
Kristian Berland, Nina Shulumba, Olle Hellman, Clas Persson, Ole Martin Løvvik; Thermoelectric transport trends in group 4 half-Heusler alloys. J. Appl. Phys. 14 October 2019; 126 (14): 145102. https://doi.org/10.1063/1.5117288
Download citation file:
Sign in
Don't already have an account? Register
Sign In
You could not be signed in. Please check your credentials and make sure you have an active account and try again.
Pay-Per-View Access
$40.00
Citing articles via
A step-by-step guide to perform x-ray photoelectron spectroscopy
Grzegorz Greczynski, Lars Hultman
Celebrating notable advances in compound semiconductors: A tribute to Dr. Wladyslaw Walukiewicz
Kirstin Alberi, Junqiao Wu, et al.
GaN-based power devices: Physics, reliability, and perspectives
Matteo Meneghini, Carlo De Santi, et al.