Enhanced Sn incorporation in GeSn epitaxial semiconductors via strain relaxation Available to Purchase

We investigate the effect of strain on the morphology and composition of GeSn layers grown on Ge/Si virtual substrates. By using buffer layers with controlled thickness and Sn content, we demonstrate that the lattice parameter can be tuned to reduce the strain in the growing top layer (TL) leading to the incorporation of Sn up to 18 at. %. For a 7 at. % bottom layer (BL) and a 11-13 at. % middle layer (ML), the optimal total thickness t_GeSn = 250-400 nm provides a large degree of strain relaxation without apparent nucleation of dislocations in the TL, while incorporating Sn at concentrations of 15 at. % and higher. Besides facilitating the growth of Sn-rich GeSn, the engineering of the lattice parameter also suppresses the gradient in Sn content in the TL, yielding a uniform composition. We correlate the formation of the surface cross-hatch pattern with the critical thickness h_G for the nucleation and gliding of misfit dislocations at the GeSn-Ge interface that originate from gliding of pre-existing threading dislocations in the substrate. When the GeSn layer thickness raises above a second critical thickness h_N, multiple interactions between dislocations take place, leading to a more extended defective ML/BL, thus promoting additional strain relaxation and reduces the compositional gradient in the ML. From these studies, we infer that the growth rate and the Ge-hydride precursors seem to have a limited influence on the growth kinetics, while lowering temperature and enhancing strain relaxation are central in controlling the composition of GeSn. These results contribute to the fundamental understanding of the growth of metastable, Sn-containing group-IV semiconductors, which is crucial to improve the fabrication and design of silicon-compatible mid-infrared photonic devices.