In this paper, terahertz monolithic integrated waveguide (TMIW) transmission lines (TLs) are analyzed and fabricated based on wide bandgap semiconductor materials. The ignored parameters of TLs at low frequencies, such as the via-hole shape, the titanium/gold thickness and roughness, and the micropipe effect of material, are especially investigated based on the semiconductor fabrication technique and the terahertz-wave theory. Subsequently, the fine optimized TMIW-TL and the transition to grounded coplanar waveguide are fabricated. The measurement shows that the attenuation constant of a TL is as low as 0.19 dB/λg at 220 GHz. The proposed TMIW can provide electrical performance similar to the conventional air-filled waveguide, while it has only 10% of the volume, which indicates a great potential for future terahertz integrated systems.

1.
Y.
Tang
,
K.
Shinohara
,
D.
Regan
,
A.
Corrion
,
D.
Brown
,
J.
Wong
,
A.
Schmitz
,
H.
Fung
,
S.
Kim
, and
M.
Micovic
,
IEEE Electron Device Lett.
36
(
6
),
549
(
2015
).
2.
S.
Chen
,
M. N.
Afsar
, and
D.
Sakdatorn
,
IEEE Trans. Instrum. Meas.
57
(
4
),
706
(
2008
).
3.
C. R.
Jones
,
J.
Dutta
,
G.
Yu
, and
Y.
Gao
,
J. Infrared Millim. Terahertz Waves
32
(
6
),
838
(
2011
).
4.
J. H.
Hwang
,
K. J.
Lee
,
S. M.
Hong
, and
J.-H.
Jang
,
IEEE Electron Device Lett.
38
(
1
),
107
(
2017
).
5.
S.
Krause
,
D.
Meledin
,
V.
Desmaris
,
A.
Pavolotsky
,
H.
Rashid
, and
V.
Belitsky
,
IEEE Trans. Terahertz Sci. Technol.
8
(
3
),
365
(
2018
).
6.
L. A.
Yang
,
Y.
Li
,
Y.
Wang
,
S. R.
Xu
, and
Y.
Hao
,
J. Appl. Phys.
119
,
164501
(
2016
).
7.
T. T.
Rong
,
L. A.
Yang
,
L.
Yang
, and
Y.
Hao
,
J. Appl. Phys
123
,
045702
(
2018
).
8.
L. A.
Yang
,
H. B.
He
,
W.
Mao
, and
Y.
Hao
,
Appl. Phys. Lett.
99
,
153501
(
2011
).
9.
K.
Elgaid
,
I. G.
Thayne
,
G.
Whyte
,
J.
Martens
, and
D.
Culver
, in
Proceedings of the 36th European Microwave Conference, Manchester
(IEEE,
2006
), p.
468
.
10.
W. T.
Khan
,
A. Ç.
Ulusoy
, and
J.
Papapolymerou
, in
Proceedings of Electronic Components and Technology Conference (ECTC)
(IEEE,
2013
), p.
2034
.
11.
T.
Makita
,
I.
Tamai
, and
S.
Seki
,
IEEE Trans. Electron Devices
58
(
3
),
709
(
2011
).
12.
A. M.
Eblabla
,
X.
Li
,
D. J.
Wallis
,
I.
Guiney
, and
K.
Elgaid
,
IEEE Trans. THz Sci. Technol.
7
(
1
),
93
(
2017
).
13.
J. X.
Zhuang
,
Z. C.
Hao
, and
W.
Hong
,
IEEE Trans. THz Sci. Technol.
5
(
6
),
1040
(
2015
).
14.
J. Q.
Ding
,
S. C.
Shi
,
K.
Zhou
,
Y.
Zhao
,
D.
Liu
, and
W.
Wu
,
IEEE Trans. THz Sci. Technol.
7
(
3
),
302
(
2017
).
15.
D.
Deslandes
and
K.
Wu
,
IEEE Trans. Microw. Theory Techn.
51
(
2
),
593
(
2003
).
16.
S. M.
Hu
,
L.
Wang
,
Y. Z.
Xiong
,
T. G.
Lim
,
B.
Zhang
,
J. L.
Shi
, and
X. J.
Yuan
,
IEEE Trans. Compon. Packag. Manuf. Technol.
1
(
2
),
260
(
2011
).
17.
Z. C.
Hao
,
W.
Ding
, and
W.
Hong
,
IEEE Trans. Microw. Theory Techn.
64
(
6
),
1775
(
2016
).
18.
D.
Stephens
,
P. R.
Young
, and
I. D.
Robertson
,
IEEE Trans. Microw. Theory Techn.
53
(
12
),
3832
(
2005
).
19.
Y.
Li
,
L. A.
Yang
,
L.
Du
,
K. Z.
Zhang
, and
Y.
Hao
,
IEEE Microw. Wireless Compon. Lett.
27
(
8
),
706
(
2017
).
20.
V.
Jovanovi’c
,
G.
Gentile
,
R.
Dekker
,
P.
de Graaf
,
L. C. N.
de Vreede
,
L. K.
Nanver
, and
M.
Spirito
,
IEEE Trans. Electron Devices
62
(
10
),
3153
(
2015
).
21.
Y.
Li
,
L. A.
Yang
,
H.
Zou
,
H. S.
Zhang
,
X. H.
Ma
, and
Y.
Hao
,
IEEE Electron Device Lett.
38
(
9
),
1290
(
2017
).
22.
F.
Xu
and
K.
Wu
,
IEEE Trans. Microw. Theory Techn.
53
(
1
),
66
(
2005
).
23.
D. M.
Pozar
,
Microwave Engineering
, 2nd ed. (
Wiley
,
New York
,
1998
), Chap. 3.
24.
R. B.
Marks
,
IEEE Trans. Microw. Theory Techn.
39
(
7
),
1205
(
1991
).
25.
S.
Hall
,
S. G.
Pytel
,
P. G.
Huray
,
D.
Hua
,
A.
Moonshiram
,
G. A.
Brist
, and
E.
Sijercic
,
IEEE Trans. Microw. Theory Techn.
55
(
12
),
2614
(
2017
).
26.
P. G.
Neudeck
and
J. A.
Powell
,
IEEE Trans. Electron Devices
15
(
2
),
63
(
1994
).
27.
M. G.
Spencer
,
J.
Palmour
, and
C.
Carter
,
IEEE Trans. Electron Devices
49
(
5
),
940
(
2002
).
28.
See https://www.cascademicrotech.com and https://www.rohde-schwarz.com for data sheets of instruments.
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