Because of the miniaturization of electronic devices, the reliability of electromigration has become a major concern when shrinking the solder dimensions in flip-chip joints. Fast reaction between solders and electrodes causes intermetallic compounds (IMCs) to form, which grow rapidly and occupy entire joints when solder volumes decrease. In this study, U-grooves were fabricated on Si chips as test vehicles. An electrode-solder-electrode sandwich structure was fabricated by using lithography and electroplating. Gaps exhibiting well-defined dimensions were filled with Sn3.5Ag solders. The gaps between the copper electrodes in the test sample were limited to less than 15 μm to simulate microbumps. The samples were stressed at various current densities at 100 °C, 125 °C, and 150 °C. The morphological changes of the IMCs were observed, and the dimensions of the IMCs were measured to determine the kinetic growth of IMCs. Therefore, this study focused on the influence of back stress caused by microstructural evolution in microbumps.
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21 January 2014
Research Article|
January 15 2014
Electromigration-induced back stress in critical solder length for three-dimensional integrated circuits
Y. T. Huang;
Y. T. Huang
Department of Chemical and Materials Engineering, National Central University
, Jhongli City 320, Taiwan
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H. H. Hsu;
H. H. Hsu
Department of Chemical and Materials Engineering, National Central University
, Jhongli City 320, Taiwan
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Albert T. Wu
Albert T. Wu
a)
Department of Chemical and Materials Engineering, National Central University
, Jhongli City 320, Taiwan
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a)
Author to whom correspondence should be addressed. Electronic mail: atwu@ncu.edu.tw
J. Appl. Phys. 115, 034904 (2014)
Article history
Received:
November 27 2013
Accepted:
December 26 2013
Citation
Y. T. Huang, H. H. Hsu, Albert T. Wu; Electromigration-induced back stress in critical solder length for three-dimensional integrated circuits. J. Appl. Phys. 21 January 2014; 115 (3): 034904. https://doi.org/10.1063/1.4861740
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