We have modeled the reflow process of FeCo magnetic nanoparticle (MNP)-based solder composites with eddy current power loss of substrate and magnetic power losses of solder bumps. For an area array package without MNPs when subjected to 300 kHz ac magnetic field, the eddy current power loss can result in excessive temperatures that can cause substrate damage. Temperature profiles with different MNP concentration were simulated and the results showed localized reflow of solders to enable low-temperature assembly. The temperatures at different times and positions in solder composites were analyzed. We also modeled thermal profiles for solder composites with 0.2 wt. % MNP in 1 MHz and 3 MHz magnetic field. Such high field frequency generated larger power losses in MNPs and is shown to increase the heating efficiency.
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7 May 2013
PROCEEDINGS OF THE 55TH ANNUAL CONFERENCE ON MAGNETISM AND MAGNETIC MATERIALS
14-18 November 2010
Atlanta, Georgia
Research Article|
Magnetism and Magnetic Materials|
March 04 2013
Modeling of localized reflow in solder/magnetic nanocomposites for area-array packaging
Siyang Xu;
Siyang Xu
a)
1Materials Science and Enginnering Department,
Carnegie Mellon University
, Pittsburgh, Pennsylvania 15213, USA
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Andrea D. Pickel;
Andrea D. Pickel
1Materials Science and Enginnering Department,
Carnegie Mellon University
, Pittsburgh, Pennsylvania 15213, USA
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Anya Prasitthipayong;
Anya Prasitthipayong
1Materials Science and Enginnering Department,
Carnegie Mellon University
, Pittsburgh, Pennsylvania 15213, USA
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Ashfaque H. Habib;
Ashfaque H. Habib
2
Pacific Northwest National Laboratory
, Richland, Washington 99352, USA
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Michael E. McHenry
Michael E. McHenry
1Materials Science and Enginnering Department,
Carnegie Mellon University
, Pittsburgh, Pennsylvania 15213, USA
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a)
Author to whom correspondence should be addressed. Electronic mail: siyangx@andrew.cmu.edu.
J. Appl. Phys. 113, 17A305 (2013)
Article history
Received:
October 04 2012
Accepted:
October 29 2012
Citation
Siyang Xu, Andrea D. Pickel, Anya Prasitthipayong, Ashfaque H. Habib, Michael E. McHenry; Modeling of localized reflow in solder/magnetic nanocomposites for area-array packaging. J. Appl. Phys. 7 May 2013; 113 (17): 17A305. https://doi.org/10.1063/1.4793516
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