This paper presents the development of a wireless magnetic field sensor consisting of a three-layer thin-film giant magnetoimpedance sensor and a surface acoustic wave device on one substrate. The goal of this integration is a passive and remotely interrogated sensor that can be easily mass fabricated using standard microfabrication tools. The design parameters, fabrication process, and a model of the integrated sensor are presented together with experimental results of the sensor.

Topics
Surface acoustic waves, Acoustic transducers, Microfabrication, Interdigital transducers, Magnetic field sensors, Electrical equipment, Microsensor, Electrodynamics, Light sensitive materials, Thin films
© 2011 American Institute of Physics.
2011
American Institute of Physics
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