This paper describes novel processes for preparing thermoelectric composite materials compatible with thick film dispenser printing fabrication processes. Optimization of process parameters to improve thermoelectric properties is introduced. We explore the use of n-type Bi2Te3 and p-type Sb2Te3 materials to achieve properties suitable for use in low cost high aspect ratio microscale thermoelectric generators. Printable thermoelectric inks consisted of dispersed semiconductor powders in an epoxy resin system. Thick films were printed on glass substrates and cured at temperatures ranging from 150 to 350°C. The best achievable power factors for n-type Bi2Te3-epoxy and p-type Sb2Te3-epoxy composite films were 1.5×104W/mK2 and 8.4×104W/mK2, respectively. Figure of merit (ZT) values for n-type Bi2Te3-epoxy and p-type Sb2Te3-epoxy composites were 0.16 and 0.41, respectively, which are much higher than previously reported ZT values for composite thermoelectric materials.

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