An electrode-free method of characterizing the microwave dielectric properties of high-permittivity thin films

A thin dielectric resonator consisting of a dielectric substrate and the thin film deposited upon it is shown to suffice for microwave characterization and dielectric parameter measurement of high-permittivity thin films without electrodes. The $TE01δ$ resonance mode was excited and measured in thin (down to 0.1 mm) rectangular- or disk-shaped low-loss dielectric substrates $(D∼10mm)$ with permittivity $ε′≥10$ inserted into a cylindrical shielding cavity or rectangular waveguide. The in-plane dielectric permittivity and losses of alumina, $DyScO3$⁠, $SmScO3$⁠, and $(LaAlO3)0.29(SrAl1/2Ta1/2O3)0.71$ (LSAT) substrates were measured from 10 to 18 GHz. The substrate thickness optimal for characterization of the overlying thin film was determined as a function of the substrate permittivity. The high sensitivity and efficiency of the method, i.e., of a thin dielectric resonator to the dielectric parameters of an overlying film, was demonstrated by characterizing ultrathin strained $EuTiO3$ films. A 22 nm thick $EuTiO3$ film grown on a (100) LSAT substrate and strained in biaxial compression by 0.9% exhibited an increase in microwave permittivity at low temperatures consistent with it being an incipient ferroelectric; no strain-induced ferroelectric phase transition was seen. In contrast, a 100 nm thick $EuTiO3$ film grown on a (110) $DyScO3$ substrate and strained in biaxial tension by 1% showed two peaks as a function of temperature in microwave permittivity and loss. These peaks correspond to a strain-induced ferroelectric phase transition near 250 K and to domain wall motion.