This paper focuses on the reliability of gravure offset printing and presents a mechanism on how the width of the printed line increases on repeated printings. Of the various printing process parameters, such as the resting times between doctoring, off, and set, printing velocity, printing pressure, and so forth, we investigated the effects of printing velocity, printing pressure, and blanket’s thickness on the reliability of gravure offset printing. As the printing velocity increases, the reliability of gravure offset printing also increases. This is because the actual contact time between ink and blanket decreases, resulting in less solvent absorption into the blanket. Printing pressure does not have much influence on reliability. Even though some change was observed, it was within the range of experimental error. Under sufficient printing pressure, this observation implies that the more important factor as regards the absorption model is time rather than pressure. As the thickness of the blanket increases, the reliability also increases. In the case of a thin blanket, in particular, the reliability of gravure offset printing is sensitive to changes in thickness.

1.
J. P.
Boeuf
,
J. Phys. D: Appl. Phys.
36
,
R53
(
2003
).
2.
P.
McGuire
,
J. C.
Cha
,
H.
Kikuchi
, and
A.
Yoda
,
IMID07 Digest
, Daegu, Korea, 27–31 August
2007
, pp.
313
315
.
3.
D. B.
Wallace
and
D. J.
Hayes
,
Int. J. Microcircuits Electron. Packag.
21
,
73
(
1998
).
4.
T. -M.
Lee
,
T. G.
Kang
,
J. S.
Yang
,
J.
Jo
,
K. -Y.
Kim
,
B. -O.
Choi
, and
D. -S.
Kim
,
J. Manuf. Sci.
130
,
031113
(
2008
).
5.
T. -M.
Lee
,
T. G.
Kang
,
J. S.
Yang
,
J.
Jo
,
K. -Y.
Kim
,
B. -O.
Choi
, and
D. -S.
Kim
,
IEEE Trans. Electron. Packag. Manuf.
31
,
202
(
2008
).
6.
W.
Jiang
,
H.
Liu
,
Y.
Ding
,
Y.
Tang
,
Y.
Shi
,
L.
Yin
, and
B.
Lu
,
J. Micromech. Microeng.
19
,
015033
(
2009
).
7.
T. -M.
Lee
,
Y. -J.
Choi
,
S. -Y.
Nam
,
C. -W.
You
,
D. -Y.
Na
,
H. -C.
Choi
,
D. -Y.
Shin
,
K. -Y.
Kim
, and
K. -I.
Jung
,
Thin Solid Films
516
,
7875
(
2008
).
8.
M.
Pudas
,
J.
Hagberg
, and
S.
Leppävuori
,
IEEE Trans. Electron. Packag. Manuf.
25
,
335
(
2002
).
9.
M.
Pudas
,
Gravure-Offset Printing in the Manufacture of Ultra-Fine-Line Thick-Films for Electronics
(
Oulu University Press
,
Oulu
,
2004
).
10.
S.
Leppävuon
,
J.
Vääbänen
,
M.
Lahtl
,
J.
Remes
, and
A.
Uusimäki
,
Sens. Actuators, A
42
,
593
(
1994
).
11.
W. -X.
Huang
,
S. -H.
Lee
,
H. W.
Kang
,
H. J.
Sung
,
T. -M.
Lee
, and
D. -S.
Kim
,
Int. J. Heat Fluid Flow
29
,
1436
(
2008
).
12.
H. W.
Kang
,
H. J.
Sung
,
T. -M.
Lee
,
D. -S.
Kim
, and
C. -J.
Kim
,
J. Micromech. Microeng.
19
,
015025
(
2009
).
13.
T.
Frecska
,
Screen Print.
74
,
156
(
1984
).
14.
M.
Shimada
,
H.
Watanabe
,
M.
Tsukamoto
, and
T.
Ishida
,
Proc. IMC
, Tokyo, Japan, May 24–26,
1990
, pp.
581
586
.
15.
S.
Niedziella
,
S.
Rudkin
, and
M.
Cooke
,
J. Chromatogr. A
885
,
457
(
2000
).
16.
J.
Lee
,
C.
Park
, and
G. M.
Whitesides
,
Anal. Chem.
75
,
6544
(
2003
).
17.
T. -M.
Lee
,
S.
Hur
,
J. -H.
Kim
, and
H. -C.
Choi
,
J. Micromech. Microeng.
20
,
015016
(
2010
).
You do not currently have access to this content.