Coarse (about ) and fine (about 100 nm) particles were synthesized by mechanical alloying for different times, respectively. Their mixtures at different ratios were consolidated by spark plasma sintering to produce nano-/microstructured composites with the same chemical compositions. The Seebeck coefficient was significantly enhanced by addition of fine particles through the potential barrier scattering. The electrical resistivity increased rapidly when the weight fraction of fine particles exceeded about 60%, probably due to an effect similar to percolation phenomenon. However, the thermal conductivity was reduced almost linearly with increasing fraction of fine particles. Because of the combined effects of the potential barrier scattering, nonlinear change in electrical property and linear change in thermal transport property, a peak value of dimensionless figure of merit was achieved for the sample containing 60% fine particles. This study demonstrated the possibility to enhance value by introducing nonuniform microstructures even without changing chemical compositions.
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15 January 2009
Research Article|
January 22 2009
Effect of mixed grain sizes on thermoelectric performance of compound
Li-Dong Zhao;
Li-Dong Zhao
1Department of Materials Science and Engineering, State Key Laboratory of New Ceramics and Fine Processing,
Tsinghua University
, Beijing, 100084, China
2School of Materials Science and Engineering,
University of Science and Technology Beijing
, Beijing, 100083, China
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Bo-Ping Zhang;
Bo-Ping Zhang
2School of Materials Science and Engineering,
University of Science and Technology Beijing
, Beijing, 100083, China
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Wei-Shu Liu;
Wei-Shu Liu
1Department of Materials Science and Engineering, State Key Laboratory of New Ceramics and Fine Processing,
Tsinghua University
, Beijing, 100084, China
2School of Materials Science and Engineering,
University of Science and Technology Beijing
, Beijing, 100083, China
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Jing-Feng Li
Jing-Feng Li
a)
1Department of Materials Science and Engineering, State Key Laboratory of New Ceramics and Fine Processing,
Tsinghua University
, Beijing, 100084, China
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a)
Author to whom correspondence should be addressed. Electronic mail: jingfeng@mail.tsinghua.edu.cn. Tel.: +8610 62784845. FAX: +8610 62771160.
J. Appl. Phys. 105, 023704 (2009)
Article history
Received:
July 04 2008
Accepted:
November 22 2008
Citation
Li-Dong Zhao, Bo-Ping Zhang, Wei-Shu Liu, Jing-Feng Li; Effect of mixed grain sizes on thermoelectric performance of compound. J. Appl. Phys. 15 January 2009; 105 (2): 023704. https://doi.org/10.1063/1.3063694
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