Both stress and atomic force microscopy (AFM) measurements were carried out in situ during potentiostatic electrodeposition of copper on gold in 0.05moldm3CuSO4 in 0.1moldm3H2SO4 with and without additives. With no additives, compressive stress generally developed initially and films subsequently underwent a compressive-to-tensile (C-T) transition. With increasing negative potential, the time for the C-T transition decreased rapidly as the rate of coalescence of nuclei (measured by AFM) increased rapidly. This is consistent with models that attribute the C-T transition to increasing tensile stress due to coalescence of nuclei. Furthermore, at a potential of 75mV(CuCu2+), where AFM showed very little coalescence of nuclei, no C-T transition was observed, again consistent with these models. The nucleation density measured by AFM increased from 2.7×107cm2 at 75mVto2.5×109cm2 at 300mV. Stress measurements with a combination of three additives [1×103moldm3Cl, 8.82×105moldm3 polyethylene glycol, and 1×105moldm3 3-mercapto-1-propanesulfonic acid sodium salt (MPSA)] also showed that compressive stress generally developed initially and its magnitude was greater than in additive-free electrolyte. At less negative potentials, even though the rate of coalescence of nuclei was rapid, as observed by AFM, the stress continued to evolve in the compressive direction. At intermediate potentials (90to150mV), classical compressive-tensile-compressive (C-T-C) behavior was observed, while at more negative potentials the stress continued to evolve in the tensile direction. Similar results were obtained with a combination of two additives (1×103moldm3Cl and 1×105moldm3 MPSA), but in that case the compressive stress appeared to be greater, and consequently the T-C transition was observed even at 500mV. The results are consistent with enhancement of a compressive component of stress in the presence of additives.

1.
O. E.
Kongstein
,
U.
Bertocci
, and
G. R.
Stafford
,
J. Electrochem. Soc.
152
,
C116
(
2005
).
2.
G. R.
Stafford
,
O. E.
Kongstein
, and
C. R.
Beauchamp
,
ECS Trans.
2
(
6
),
185
(
2007
).
3.
G. G.
Láng
and
M.
Seo
,
Electroanal. Chem.
490
,
98
(
2000
).
4.
W.
Haiss
,
R. J.
Nichols
, and
J.-K.
Sass
,
Surf. Sci.
388
,
141
(
1997
).
5.
S. J.
Hearne
and
J. A.
Floro
,
J. Appl. Phys.
97
,
014901
(
2005
).
6.
C.
Friesen
,
S. C.
Seel
, and
C. V.
Thompson
,
J. Appl. Phys.
95
,
1011
(
2004
).
7.
R. C.
Cammarata
,
T. M.
Trimble
, and
D. J.
Srolovitz
,
J. Mater. Res.
15
,
2468
(
2000
).
8.
J. A.
Floro
,
S. J.
Hearne
,
J. A.
Hunter
,
P.
Kotula
,
E.
Chason
,
S. C.
Seel
, and
C. V.
Thompson
,
J. Appl. Phys.
89
,
4886
(
2001
).
9.
B. W.
Sheldon
,
A.
Rajamani
,
A.
Bhandari
,
E.
Chason
,
S. K.
Hong
, and
R.
Beresford
,
J. Appl. Phys.
98
,
043509
(
2005
).
10.
R.
Koch
,
J. Phys.: Condens. Matter
6
,
9519
(
1994
).
11.
R. W.
Hoffman
, in
Physics of Thin Films
, edited by
G.
Hass
and
R. E.
Thun
(
Academic
,
New York
,
1966
), Vol.
3
, p.
211
.
12.
R.
Abermann
,
R.
Kramer
, and
J.
Mäser
,
Thin Solid Films
52
,
215
(
1978
).
13.
E.
Chason
,
B. W.
Sheldon
,
L. B.
Freund
,
J. A.
Floro
, and
S. J.
Hearne
,
Phys. Rev. Lett.
88
,
156103
(
2002
).
15.
G. G.
Stoney
,
Proc. R. Soc. London, Ser. A
82
,
172
(
1909
).
16.
G. G.
Láng
,
K.
Ueno
,
M.
Újvári
, and
M.
Seo
,
J. Phys. Chem. B
104
,
2785
(
2000
).
17.
S.
Cattarin
,
E.
Pantano
, and
F.
Decker
,
Electrochem. Commun.
1
,
483
(
1999
).
18.
K.
Ueno
and
M.
Seo
,
J. Electrochem. Soc.
146
,
1496
(
1999
).
19.
A.
Brenner
and
S.
Senderoff
,
J. Res. Natl. Bur. Stand.
42
,
105
(
1949
).
20.
R.
Weil
,
Plating
58
,
137
(
1971
).
21.
R.
Weil
,
Plating
57
,
1231
(
1970
).
22.
R.
Weil
,
Plating
58
,
50
(
1971
).
23.
P.
Chaudhari
,
J. Vac. Sci. Technol.
9
,
520
(
1971
).
24.
S.
Timoshenko
,
J. Opt. Soc. Am.
11
,
233
(
1925
).
25.
S.
Nakahara
,
S.
Ahmed
,
T. T.
Ahmed
, and
D. N.
Buckley
,
J. Electrochem. Soc.
154
,
D145
(
2007
).
26.
C.
Friesen
and
C. V.
Thompson
,
Phys. Rev. Lett.
89
,
126103
(
2002
).
27.
T.
Chowdhury
,
S.
Ahmed
,
D. N.
Buckley
,
M.
Laugier
, and
S.
Nakahara
,
ECS Trans.
1
(
11
),
93
(
2006
).
28.
J. M. E.
Harper
,
C.
Carbal
, Jr.
,
P. C.
Andricacos
,
L.
Gignac
,
I. C.
Noyan
, and
K. P.
Rodbell
,
J. Appl. Phys.
86
,
2516
(
1999
).
29.
A.
Bhandari
,
B. W.
Sheldon
, and
S. J.
Hearne
,
J. Appl. Phys.
101
,
033528
(
2007
).
30.
R. W.
Hoffman
,
Surf. Interface Anal.
3
,
62
(
1981
).
31.
T. P.
Moffat
,
J. E.
Bonevich
,
W. H.
Huber
,
A.
Stanishevsky
,
D. R.
Kelly
,
G. R.
Stafford
, and
D.
Josell
,
J. Electrochem. Soc.
147
,
4524
(
2000
).
32.
P. C.
Andricacos
,
C.
Uzoh
,
J. O.
Dukovic
,
J.
Horkans
, and
H.
Deligianni
,
IBM J. Res. Dev.
42
,
567
(
1998
).
33.
C.
Madore
,
M.
Matlosz
, and
D.
Landolt
,
J. Electrochem. Soc.
143
,
3927
(
1996
).
34.
C.
Madore
and
D.
Landolt
,
J. Electrochem. Soc.
143
,
3936
(
1996
).
35.
D. N.
Buckley
and
S.
Ahmed
,
Electrochem. Solid-State Lett.
6
,
C33
(
2003
).
36.
S.
Ahmed
,
D. N.
Buckley
,
S.
Nakahara
,
T. T.
Ahmed
, and
Y.
Kuo
,
J. Electrochem. Soc.
154
,
D103
(
2007
).
37.
S.
Nakahara
,
S.
Ahmed
, and
D. N.
Buckley
,
Electrochem. Solid-State Lett.
10
,
D17
(
2007
).
38.
S.
Ahmed
,
T. T.
Ahmed
,
D. N.
Buckley
, and
S.
Nakahara
,
ECS Trans.
2
(
6
),
229
(
2007
).
39.
S.
Ahmed
,
D. N.
Buckley
,
A.
Arshak
,
A. M.
O’Connell
, and
L. D.
Burke
,
The Electrochemical Society Proceedings Series
,
Pennington, NJ
,
2003
edited by
G. S.
Mathad
,
T. S.
Cale
,
D.
Collins
,
M.
Engelhardt
,
F.
Leverd
, and
H. S.
Rathore
, Volume PV 2003–13, p.
110
.
40.
W. U.
Schmidt
,
R. C.
Alkire
, and
A. A.
Gewirth
,
J. Electrochem. Soc.
143
,
3122
(
1996
).
41.
A. A.
Gewirth
and
B. K.
Niece
,
Chem. Rev. (Washington, D.C.)
97
,
1129
(
1997
).
42.
M.
Breathnach
,
S.
Ahmed
,
S.
Nakahara
, and
D. N.
Buckley
,
ECS Trans.
1
(
11
),
25
(
2006
).
43.
M.
Breathnach
,
S.
Ahmed
,
S.
Nakahara
, and
D. N.
Buckley
,
ECS Trans.
2
(
6
),
157
(
2007
).
44.
R.
Aberman
and
R.
Koch
,
Thin Solid Films
129
,
71
(
1985
).
45.
A. L.
Shull
and
F.
Spaepen
,
J. Appl. Phys.
80
,
6243
(
1996
).
46.
R. C.
Cammarata
,
Prog. Surf. Sci.
46
,
1
(
1994
).
47.
R. W.
Hoffman
,
Thin Solid Films
34
,
185
(
1976
).
48.
W. D.
Nix
and
B. M.
Clemens
,
J. Mater. Res.
14
,
3467
(
1999
).
49.
S. C.
Seel
,
C. V.
Thompson
,
S. J.
Hearne
, and
J. A.
Floro
,
J. Appl. Phys.
88
,
7079
(
2000
).
50.
L. B.
Freund
and
E.
Chason
,
J. Appl. Phys.
89
,
4866
(
2001
).
51.
A. A.
Griffith
,
Philos. Trans. R. Soc. London, Ser. A
221
,
163
(
1920
).
52.
K. L.
Johnson
,
Contact Mechanics
Cambridge University Press
(
Cambridge
,
1985
).
53.
B. W.
Sheldon
,
A.
Ditkowski
,
R.
Beresford
,
E.
Chason
, and
J.
Rankin
,
J. Appl. Phys.
94
,
948
(
2003
).
You do not currently have access to this content.