Co-rich CoPtP alloys have been electrodeposited using direct current (dc) and pulse-reverse (PR) plating techniques. The surface morphology, crystalline structure, grain size, and magnetic properties of the plated films have been compared. The x-ray analysis and magnetic measurements reveal the presence of Co hcp hard magnetic phase with axis perpendicular to the substrate for dc and in plane for PR plated films. The dc plated films have a granular structure in the micron scale with large cracks, which are manifestation of stress in the film. Only by using a combination of optimized PR plating conditions and stress relieving additive, we are able to produce thick (for hour of plating), stress-free, and nanostructured Co-rich CoPtP single hcp phase at room temperature, with an intrinsic coercivity of .
Development of nanostructured, stress-free Co-rich CoPtP films for magnetic microelectromechanical system applications
Santosh Kulkarni, Saibal Roy; Development of nanostructured, stress-free Co-rich CoPtP films for magnetic microelectromechanical system applications. J. Appl. Phys. 1 May 2007; 101 (9): 09K524. https://doi.org/10.1063/1.2712032
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