Chemistry of Cu deposition by Cu(hfac)(tmvs) monitored by $Li+$ ion attachment mass spectrometry

Ion attachment mass spectrometry was used for continuous in situ analysis of coordinated products formed during copper chemical vapor deposition (Cu CVD) by Cu(1,1,1,5,5,5-hexafluoroacetylacetonate)(vinyltrimethylsilane) [Cu(hfac)(tmvs)] in a simple tubular reactor. This study of the thermally labile Cu(hfac)(tmvs) demonstrated the utility of this method for detecting molecular ions of labile compounds. The results demonstrate the feasibility of monitoring the deposition chemistry of Cu(hfac)(tmvs) by generating $Li+$ adduct molecular ions by means of the $Li+$ ion attachment technique. The reaction pathways for Cu CVD by Cu(hfac)(tmvs) were studied by analysis of the reaction products. H(hfac) and tmvs were identified as the main products when Cu(hfac)tmvs was heated at temperatures ranging from room temperature to $160°C$ in the reactor. The rate constant for Cu deposition, $k$ $(1∕s)$⁠, was determined to be $1.6×106exp(−10.2kcal∕molRt)$⁠.