Complex three-dimensional high aspect ratio microfluidic network manufactured in combined PerMX dry-resist and SU-8 technology

In this paper we present a new fabrication method that combines for the first time popular SU-8 technology and PerMX dry-photoresist lamination for the manufacturing of high aspect ratio three-dimensional multi-level microfluidic networks. The potential of this approach, which further benefits from wafer-level manufacturing and accurate alignment of fluidic levels, is demonstrated by a highly integrated three-level microfluidic chip. The hereby achieved network complexity, including 24 fluidic vias and 16 crossing points of three individual microchannels on less than 13 mm² chip area, is unique for SU-8 based fluidic networks. We further report on excellent process compatibility between SU-8 and PerMX dry-photoresist which results in high interlayer adhesion strength. The tight pressure sealing of a fluidic channel (0.5 MPa for 1 h) is demonstrated for 150 μm narrow SU-8/PerMX bonding interfaces.