The emerging internet of things requires autonomous and ubiquitous on-chip devices with wireless interconnectivity. On-chip power is required to meet the miniaturization requirement, and an integrated on-chip micro-supercapacitor has enormous potential to meet this requirement owing to its high-power density and long cycle life. However, the two-dimensional expansion of the current co-planer design paradigm of micro-supercapacitors, such as the interdigital layout, hinders the on-chip integration density, resulting in a significant consumption of precious chip footprint and an insufficient energy density. This article reports on the use of a three-dimensional framework along with a hybrid printing strategy to fabricate devices entirely without any post-processing, and highly integrated three-dimensional micro-supercapacitors were printed as proof of concept. The micro-supercapacitors exhibit more than 25 times areal capacitance than the interdigital ones (76 mF/cm2 vs 2.9 mF/cm2) due to their three-dimensional feature. Moreover, it can provide new functions to achieve adjustable voltage and capacitance flexibility within one device's footprint area. This approach can also enable devices on different substrates. An ultraviolet sensor was integrated with and powered by the three-dimensional micro-supercapacitors on polyimide to demonstrate the compact on-chip application. The three-dimensional framework offers a general solution to the on-chip integration challenges of micro-supercapacitors. Moreover, it can be extended to new materials or even other electronics units, highlighting the promise of further miniaturized and powerful micro-electronics.
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Hybrid printed three-dimensionally integrated micro-supercapacitors for compact on-chip application
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March 2021
Research Article|
January 08 2021
Hybrid printed three-dimensionally integrated micro-supercapacitors for compact on-chip application
Jingzhi Hu;
Jingzhi Hu
1
Research & Development Institute of Northwestern Polytechnical University in Shenzhen, Northwestern Polytechnical University
, Shenzhen 518057, China
2
State Key Laboratory of Solidification Processing, Center for Nano Energy Materials, and School of Materials Science and Engineering, Northwestern Polytechnical University
, Xi'an 710072, China
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Jun Luo;
Jun Luo
3
School of Mechanical Engineering, Northwestern Polytechnical University
, 127 Youyi West Road, Xi'an 710072, China
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Zhaohua Xu;
Zhaohua Xu
1
Research & Development Institute of Northwestern Polytechnical University in Shenzhen, Northwestern Polytechnical University
, Shenzhen 518057, China
2
State Key Laboratory of Solidification Processing, Center for Nano Energy Materials, and School of Materials Science and Engineering, Northwestern Polytechnical University
, Xi'an 710072, China
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Keyu Xie;
Keyu Xie
a)
1
Research & Development Institute of Northwestern Polytechnical University in Shenzhen, Northwestern Polytechnical University
, Shenzhen 518057, China
2
State Key Laboratory of Solidification Processing, Center for Nano Energy Materials, and School of Materials Science and Engineering, Northwestern Polytechnical University
, Xi'an 710072, China
a)Author to whom correspondence should be addressed: [email protected]
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Haoran Yu;
Haoran Yu
2
State Key Laboratory of Solidification Processing, Center for Nano Energy Materials, and School of Materials Science and Engineering, Northwestern Polytechnical University
, Xi'an 710072, China
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Hanming Wang;
Hanming Wang
2
State Key Laboratory of Solidification Processing, Center for Nano Energy Materials, and School of Materials Science and Engineering, Northwestern Polytechnical University
, Xi'an 710072, China
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Chao Shen;
Chao Shen
1
Research & Development Institute of Northwestern Polytechnical University in Shenzhen, Northwestern Polytechnical University
, Shenzhen 518057, China
2
State Key Laboratory of Solidification Processing, Center for Nano Energy Materials, and School of Materials Science and Engineering, Northwestern Polytechnical University
, Xi'an 710072, China
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Le-hua Qi;
Le-hua Qi
b)
3
School of Mechanical Engineering, Northwestern Polytechnical University
, 127 Youyi West Road, Xi'an 710072, China
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Bingqing Wei
Bingqing Wei
c)
4
Department of Mechanical Engineering, University of Delaware
, Newark, Delaware 19716, USA
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a)Author to whom correspondence should be addressed: [email protected]
b)
E-mail: [email protected]
c)
E-mail: [email protected]
Appl. Phys. Rev. 8, 011401 (2021)
Article history
Received:
September 03 2020
Accepted:
December 22 2020
Citation
Jingzhi Hu, Jun Luo, Zhaohua Xu, Keyu Xie, Haoran Yu, Hanming Wang, Chao Shen, Le-hua Qi, Bingqing Wei; Hybrid printed three-dimensionally integrated micro-supercapacitors for compact on-chip application. Appl. Phys. Rev. 1 March 2021; 8 (1): 011401. https://doi.org/10.1063/5.0028210
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