Phonon modes at microwave frequencies can be cooled to their quantum ground state using conventional cryogenic refrigeration, providing a convenient way to study and manipulate quantum states at the single phonon level. Phonons are of particular interest because mechanical deformations can mediate interactions with a wide range of different quantum systems, including solid-state defects, superconducting qubits, and optical photons when using optomechanically active constructs. Phonons, thus, hold promise for quantum-focused applications as diverse as sensing, information processing, and communication. Here, we describe a piezoelectric quantum bulk acoustic resonator (QBAR) with a 4.88 GHz resonant frequency, which, at cryogenic temperatures, displays large electromechanical coupling strength combined with a high intrinsic mechanical quality factor, Qi4.3×104. Using a recently developed flip-chip technique, we couple this QBAR resonator to a superconducting qubit on a separate die and demonstrate the quantum control of the mechanics in the coupled system. This approach promises a facile and flexible experimental approach to quantum acoustics and hybrid quantum systems.

Hybrid quantum systems have attracted significant recent interest, for applications in both quantum information processing1–3 and quantum engineering and technology.4–6 Quantum acoustics can play an essential role in hybrid quantum systems, as mechanical degrees of freedom can couple to many systems, including superconducting qubits,7–15 spin ensembles,16,17 and optical photons,18–23 and can serve as quantum memories.24,25 On-demand generation of single phonons has been achieved by coupling superconducting qubits via a piezoelectric interaction to film bulk acoustic resonators, to surface acoustic wave resonators, and to bulk acoustic resonators.7,10–12,26 However, phonons do not approach the lifetimes of photons in electromagnetic cavities.27 Here, we describe one approach that may achieve levels of performance similar to photons while affording simple lithographic fabrication.

Our quantum system comprises a high-Q electromechanical resonator made on a silicon substrate and a superconducting qubit made on a separate sapphire substrate, with both coupled using a flip-chip method.28 This approach differs from the previous qubit-coupled experiments7,8,13,14 where qubits were fabricated on the same substrate as the mechanical structure, yielding poor qubit performance. Here, the flip-chip approach preserves the qubit lifetime.10–12,15,26 The mechanical resonator, shown in Fig. 1, is a mechanically suspended bilayer of single-crystal Si with a piezoelectrically active aluminum nitride (AlN) layer, actuated using an interdigital transducer (IDT), which yields a large electromechanical coupling. The structure is supported by acoustic mirrors,24 reducing phonon leakage through the mechanical supports. The choice of materials and overall design affords more flexibility in the resonator properties, including operating frequency, mechanical mode selection, and electromechanical coupling strength, as well as allowing better mechanical isolation. The structure exhibits a resonant mechanical mode at 4.88 GHz, making the mechanical quantum ground state accessible by cooling the device to mK temperatures. We term this new design a quantum bulk acoustic resonator (QBAR).

FIG. 1.

Thin film quantum bulk acoustic resonator (QBAR). (a) Scanning electron micrograph (SEM) of the resonator structure, an acoustically resonant membrane 200×80μm2 in area, made of a 220 nm thick single-crystal Si layer supporting a 330 nm thick, c-axis oriented piezoelectric AlN layer, supported on either side by an acoustic mirror. Actuation and detection are via an IDT comprising forty Al finger pairs, with alternate fingers connected to one of a pair of wirebond pads (not shown). (b and c) Details of the structure in (a), showing details of the IDT and the acoustic mirror supports. Each mirror is 15 phononic crystal unit cells wide, on either side of the resonator. (d) and (e) Detailed design of the phononic crystal unit cell, with dimension (H, W, R1, R2, a, T) = (466, 177, 40, 25, 550, 220) nm. The sidewall angle θ is ∼85°. (f) Finite-element simulation of the band structure for the phononic crystal; the dashed line indicates the QBAR resonant frequency, and the phononic crystal bandgap is shaded purple.

FIG. 1.

Thin film quantum bulk acoustic resonator (QBAR). (a) Scanning electron micrograph (SEM) of the resonator structure, an acoustically resonant membrane 200×80μm2 in area, made of a 220 nm thick single-crystal Si layer supporting a 330 nm thick, c-axis oriented piezoelectric AlN layer, supported on either side by an acoustic mirror. Actuation and detection are via an IDT comprising forty Al finger pairs, with alternate fingers connected to one of a pair of wirebond pads (not shown). (b and c) Details of the structure in (a), showing details of the IDT and the acoustic mirror supports. Each mirror is 15 phononic crystal unit cells wide, on either side of the resonator. (d) and (e) Detailed design of the phononic crystal unit cell, with dimension (H, W, R1, R2, a, T) = (466, 177, 40, 25, 550, 220) nm. The sidewall angle θ is ∼85°. (f) Finite-element simulation of the band structure for the phononic crystal; the dashed line indicates the QBAR resonant frequency, and the phononic crystal bandgap is shaded purple.

Close modal

The mechanical device is fabricated on a commercial silicon-on-insulator (SOI) wafer with a 220 nm device layer and a 2 μm buried oxide layer. We first deposit and pattern a 70 nm thick SiOx stop layer, which protects the active device area's top Si surface from subsequent etching steps. Next, a c-axis oriented 330 nm thick aluminum nitride (AlN) piezoelectric layer is deposited by reactive sputter deposition,29 using conditions that typically yield an in-plane tensile stress below 200 MPa. The AlN film is reactive-ion etched (RIE) using a reflowed photoresist mask, and the exposed underlying SiOx stop layer is removed using buffered HF. To avoid subsequent damage to the AlN, we deposit a 5nm SiOx layer using atomic layer deposition. Phononic crystals are patterned using electron beam lithography, followed by a Cl2/O2 RIE. E-beam lithography defines a PMMA bilayer for liftoff of a 30 nm thick aluminum interdigital transducer (IDT) and ground plane. The wafer is diced into dies, each with closely related designs, with one die used for the classical measurements in Figs. 2 and 3 and a different die used for the quantum experiment in Fig. 4. The devices are released in HF vapor; an image is shown in Fig. 1.

FIG. 2.

Room temperature microwave transmission measurements. (a) Main panel shows the transmission magnitude |S21| measured by a vector network analyzer (VNA) connected via a microwave probe station. The inset shows the equivalent electrical circuit, based on the Butterworth-van Dyke model; 1 and 2 correspond to VNA ports. (b) Left: Magnitude |S21| and phase S21 (blue) near the QBAR electromechanical resonance at f0=4.88 GHz. Right: Inverse 1/S̃21 (blue) in the complex plane (horizontal axis: real part; vertical axis: imaginary part). Dashed lines (red) are fits to Eq. (2).

FIG. 2.

Room temperature microwave transmission measurements. (a) Main panel shows the transmission magnitude |S21| measured by a vector network analyzer (VNA) connected via a microwave probe station. The inset shows the equivalent electrical circuit, based on the Butterworth-van Dyke model; 1 and 2 correspond to VNA ports. (b) Left: Magnitude |S21| and phase S21 (blue) near the QBAR electromechanical resonance at f0=4.88 GHz. Right: Inverse 1/S̃21 (blue) in the complex plane (horizontal axis: real part; vertical axis: imaginary part). Dashed lines (red) are fits to Eq. (2).

Close modal
FIG. 3.

Microwave transmission measurements at T80 mK. (a) Transmission magnitude |S21| displays three resonances at 1.69, 4.88, and 8.50 GHz, in reasonable agreement with simulations, shown as strain maps (normalized) (inset). (b) Left: Details of the primary resonance at f0=4.88 GHz, plotted in amplitude and phase vs detuning ff0. Right: S̃211 plotted in the complex plane (blue). Dashed lines (red) are fits to Eq. (2). We estimate the excitation corresponding to 106 phonons.

FIG. 3.

Microwave transmission measurements at T80 mK. (a) Transmission magnitude |S21| displays three resonances at 1.69, 4.88, and 8.50 GHz, in reasonable agreement with simulations, shown as strain maps (normalized) (inset). (b) Left: Details of the primary resonance at f0=4.88 GHz, plotted in amplitude and phase vs detuning ff0. Right: S̃211 plotted in the complex plane (blue). Dashed lines (red) are fits to Eq. (2). We estimate the excitation corresponding to 106 phonons.

Close modal
FIG. 4.

Qubit-mediated measurements of the mechanical resonator. (a) Electrical circuit diagram, showing qubit (blue) and tunable coupler (purple), one arm of which couples inductively (black) to the IDT (red). Two acoustic mirrors consist of phononic crystal arrays (brown). (b) Photograph of flip-chip assembly, comprising a 6×6cm2 qubit die (bottom) and a 4×2cm2 resonator die (top). (c) Qubit spectroscopy, showing excited state probability Pe vs qubit frequency (horizontal) and microwave pulse frequency (vertical). An avoided-level crossing appears when the qubit and resonator are in resonance. Two energy splittings can be observed, with the larger corresponding to the primary mechanical mode (2g/2π9.6MHz) and the other a spurious mechanical mode (2gspur/2π3.5MHz). Dashed lines (black) are fits to a modified Jaynes–Cummings model including two resonant modes. (d) Phonon lifetime measurement. The inset shows the pulse sequence. The main panel shows the qubit final excited state probability Pe, where the exponential decay is primarily due to the phonon lifetime of 178 ns, as fit by the dashed line (red). (e) Qubit-resonator Rabi swaps. The probability of the qubit excited state Pe (color scale) is plotted vs qubit frequency fq (horizontal) and qubit-resonator interaction time (vertical). Coupling strengths are 2g/2π11.2MHz and 2gspur/2π3.5MHz for primary and spurious mechanical modes, respectively. Left: simulation results. Right: experimental results.

FIG. 4.

Qubit-mediated measurements of the mechanical resonator. (a) Electrical circuit diagram, showing qubit (blue) and tunable coupler (purple), one arm of which couples inductively (black) to the IDT (red). Two acoustic mirrors consist of phononic crystal arrays (brown). (b) Photograph of flip-chip assembly, comprising a 6×6cm2 qubit die (bottom) and a 4×2cm2 resonator die (top). (c) Qubit spectroscopy, showing excited state probability Pe vs qubit frequency (horizontal) and microwave pulse frequency (vertical). An avoided-level crossing appears when the qubit and resonator are in resonance. Two energy splittings can be observed, with the larger corresponding to the primary mechanical mode (2g/2π9.6MHz) and the other a spurious mechanical mode (2gspur/2π3.5MHz). Dashed lines (black) are fits to a modified Jaynes–Cummings model including two resonant modes. (d) Phonon lifetime measurement. The inset shows the pulse sequence. The main panel shows the qubit final excited state probability Pe, where the exponential decay is primarily due to the phonon lifetime of 178 ns, as fit by the dashed line (red). (e) Qubit-resonator Rabi swaps. The probability of the qubit excited state Pe (color scale) is plotted vs qubit frequency fq (horizontal) and qubit-resonator interaction time (vertical). Coupling strengths are 2g/2π11.2MHz and 2gspur/2π3.5MHz for primary and spurious mechanical modes, respectively. Left: simulation results. Right: experimental results.

Close modal

The electromechanical resonator is characterized using a calibrated vector network analyzer (VNA), shown in Fig. 2. We find a strong resonant response at the electromechanical resonance frequency f0=ω0/2π=4.88 GHz, as expected, and fit the response to a Butterworth-van Dyke model circuit (BvD),7,30 shown in the inset in Fig. 2. This model includes the transducer electrical capacitance C0 in parallel with the mechanical equivalent inductance and capacitance L and C, as well as a mechanical loss element R. The values for C0 and C are determined from the known geometry and materials for the device, and the values for L and R fit to the measured response. Near the electromechanical resonance f0=(C+C0)/(LCC0)/2π, the BvD model has an equivalent impedance Zr(f) given by

(1)

where Z1=(1+iω0RCω02LC)/(ω0(C+C0)) with phase factor eiϕ and Qi=L(C+C0)/CC0/R is the internal quality factor. The inverse transmission is

(2)

where Z0=50Ω. A fit to the data (Fig. 2) yields the internal quality factor Qi1.0×103 (measured at room temperature).

We characterize the resonator at temperatures below 1 K using an adiabatic demagnetization refrigerator (base temperature, 60mK). Excitation signals from a VNA with –40 dBm output power, which corresponds to about 106 phonons in the cavity, pass through a 20 dB attenuator, with the reflection from the device amplified by room-temperature amplifiers with a net gain of 20 dB. The results are displayed in Fig. 3. The resonant frequency remains unchanged from room temperature, while Qi increases by a factor of 40 to Qi4.3×104. As substrate loss is significantly decreased at cryogenic temperatures, additional resonant modes become detectable, consistent with finite-element simulations, shown in Fig. 3(a).

A superconducting qubit is a unique tool to characterize mechanical resonators in the quantum limit.7,10–15,26 Here, we use a frequency-tunable planar Xmon qubit31,32 to characterize a QBAR very similar to that measured classically. The qubit is fabricated on a separate sapphire die, with wiring on the two dies including mutual inductive couplers;28 a schematic is shown in Fig. 4a. The sapphire and SOI dies are aligned and attached to one another using photoresist, with vertical spacing defined by 5μm thick spacers.28 A flux-tunable coupler element10 is placed between the qubit and its mutual coupling inductance, allowing the external flux control of the coupling strength, from zero to a maximum of 2g/2π11.2MHz.

With the coupler off (coupling rate, 2g/2π0 MHz), we measure the intrinsic qubit T1qb= 10 μs and T2,Ramseyqb= 1 μs, for qubit frequencies ranging from 4.5 to 5.0 GHz, with both measured using standard techniques.32 As we increase the coupling strength from zero, the qubit response includes the resonator and becomes more complex, in particular near the resonator frequency. In Fig. 4(c), we show a qubit spectroscopy measurement with the coupler set to a coupling 2g/2π=9.6MHz. After setting the qubit frequency (horizontal axis), the qubit is gently excited by a 1 μs excitation microwave tone at the drive frequency (vertical axis) and the qubit excited state probability Pe measured (color scale). The qubit tunes as expected, exhibiting the expected splitting as it crosses the mechanical resonator frequency at fr=4.86GHz. There is an additional spurious mode that is weakly coupled to the qubit at 4.87 GHz, with a splitting of about 2gspur/2π=3.5MHz. This spurious mode may come from a slight difference between the IDT resonant frequency and that of the QBAR.

We next use the qubit to perform a single-phonon lifetime measurement,7 using the pulse sequence in Fig. 4(d). From the decay of Pe(t) with delay t, we extract the resonator's energy relaxation time T1,r=178±2 ns. This corresponds to a single-phonon quality factor Qi(5.43±0.06)×103, slightly smaller than the device measured in Fig. 3. We believe that the reduction in the quality factor compared to the measurements shown in Fig. 3 is due to spurious two-level system defects33,34 that are saturated at the higher powers (106 phonons) used in Fig. 3 compared to the single-phonon energies used here.35 

In Fig. 4(e), we display a qubit-resonator Rabi swap, measured as a function of time (vertical axis) and as a function of qubit detuning from the resonator frequency (horizontal axis). A microwave pulse places the qubit in its excited state, and the coupling between the qubit and resonator is turned on, initiating the Rabi swap. By measuring the qubit state at different times, we capture the excitation as it is exchanged between the qubit and resonator, whereas the qubit-resonator detuning increases, the swap rate increases, but the amplitude decreases. The spurious mode interferes with this process, generating a non-ideal response, consistent with the spectroscopy measurement. The lifetime of the Rabi swap process is significantly shorter than that measured in Fig. 4(d), implying that an unknown additional loss is introduced when we leave the qubit variable coupler on.

We used numerical simulations to support our experimental results. The simulations use a modified Jaynes–Cummings model, where the qubit is modeled as a two-level system coupled to two harmonic oscillators, representing the main and spurious mechanical modes, with different coupling strengths at the frequencies 4.86 and 4.87 GHz, respectively. Both the avoided-level crossing in Fig. 4(c) and the Rabi swap measurement in Fig. 4(e) are supported by this model, from which we extract a T1,rspur lifetime for the spurious mode of 70 ns.

In conclusion, we have designed and fabricated a microwave-frequency quantum bulk acoustic resonator with a resonance frequency just below 5 GHz and a single-phonon intrinsic quality factor of Qi(5.43±0.06)×103; a companion device measured with a VNA has Qi4.3×104. These quality factors are roughly 20 times and 200 times higher than those obtained in our previous experiment on thin-film bulk acoustic resonators,7 although they do not yet approach those on wafer-thickness bulk resonators.9,11,36,37 The piezoelectric construction of the resonator supports a strong electromechanical coupling rate, allowing us to couple it to a superconducting qubit for quantum measurements. This approach holds promise for high quality factor, very small form-factor resonant acoustic cavities operating in the quantum limit, with potential applications to hybrid quantum systems, quantum communication, and quantum computing.

The authors thank P. J. Duda for fabrication assistance and F. J. Heremans and N. Delegan for help with the AlN sputter system. Devices and experiments were supported by the Air Force Office of Scientific Research and the Army Research Laboratory. K.J.S. was supported by NSF GRFP (NSF No. DGE-1144085), É.D. was supported by LDRD funds from Argonne National Laboratory, and A.N.C. was supported in part by the DOE, Office of Basic Energy Sciences. This work was partially supported by the UChicago MRSEC (NSF No. DMR-1420709) and made use of the Pritzker Nanofabrication Facility, which receives support from SHyNE, a node of the National Science Foundation's National Nanotechnology Coordinated Infrastructure (No. NSF NNCI-1542205).

The authors declare no competing financial interest.

The data that support the findings of this study are available from the corresponding author upon reasonable request.

1.
Z.-L.
Xiang
,
S.
Ashhab
,
J. Q.
You
, and
F.
Nori
,
Rev. Mod. Phys.
85
,
623
(
2013
).
2.
M.
Aspelmeyer
,
T. J.
Kippenberg
, and
F.
Marquardt
,
Rev. Mod. Phys.
86
,
1391
(
2014
).
3.
A. A.
Clerk
,
K. W.
Lehnert
,
P.
Bertet
,
J. R.
Petta
, and
Y.
Nakamura
,
Nat. Phys.
16
,
257
(
2020
).
4.
G.
Kurizki
,
P.
Bertet
,
Y.
Kubo
,
K.
Mølmer
,
D.
Petrosyan
,
P.
Rabl
, and
J.
Schmiedmayer
,
Proc. Natl. Acad. Sci. U. S. A.
112
,
3866
(
2015
).
5.
C. L.
Degen
,
F.
Reinhard
, and
P.
Cappellaro
,
Rev. Mod. Phys.
89
,
035002
(
2017
).
6.
J. J.
Morton
and
P.
Bertet
,
J. Magn. Reson.
287
,
128
(
2018
).
7.
A. D.
O'Connell
,
M.
Hofheinz
,
M.
Ansmann
,
R. C.
Bialczak
,
M.
Lenander
,
E.
Lucero
,
M.
Neeley
,
D.
Sank
,
H.
Wang
,
M.
Weides
,
J.
Wenner
,
J. M.
Martinis
, and
A. N.
Cleland
,
Nature
464
,
697
(
2010
).
8.
M. V.
Gustafsson
,
T.
Aref
,
A. F.
Kockum
,
M. K.
Ekstrom
,
G.
Johansson
, and
P.
Delsing
,
Science
346
,
207
(
2014
).
9.
Y.
Chu
,
P.
Kharel
,
W. H.
Renninger
,
L. D.
Burkhart
,
L.
Frunzio
,
P. T.
Rakich
, and
R. J.
Schoelkopf
,
Science
358
,
199
(
2017
).
10.
K. J.
Satzinger
,
Y. P.
Zhong
,
H.-S.
Chang
,
G. A.
Peairs
,
A.
Bienfait
,
M.-H.
Chou
,
A. Y.
Cleland
,
C. R.
Conner
,
É.
Dumur
,
J.
Grebel
,
I.
Gutierrez
,
B. H.
November
,
R. G.
Povey
,
S. J.
Whiteley
,
D. D.
Awschalom
,
D. I.
Schuster
, and
A. N.
Cleland
,
Nature
563
,
661
(
2018
).
11.
Y.
Chu
,
P.
Kharel
,
T.
Yoon
,
L.
Frunzio
,
P. T.
Rakich
, and
R. J.
Schoelkopf
,
Nature
563
,
666
(
2018
).
12.
A.
Bienfait
,
K. J.
Satzinger
,
Y. P.
Zhong
,
H.-S.
Chang
,
M.-H.
Chou
,
C. R.
Conner
,
É.
Dumur
,
J.
Grebel
,
G. A.
Peairs
,
R. G.
Povey
, and
A. N.
Cleland
,
Science
364
,
368
(
2019
).
13.
P.
Arrangoiz-Arriola
,
E. A.
Wollack
,
Z.
Wang
,
M.
Pechal
,
W.
Jiang
,
T. P.
McKenna
,
J. D.
Witmer
,
R.
Van Laer
, and
A. H.
Safavi-Naeini
,
Nature
571
,
537
(
2019
).
14.
L. R.
Sletten
,
B. A.
Moores
,
J. J.
Viennot
, and
K. W.
Lehnert
,
Phys. Rev. X
9
,
021056
(
2019
).
15.
M.
Kervinen
,
A.
Välimaa
,
J. E.
Ramírez-Muñoz
, and
M. A.
Sillanpää
,
Phys. Rev. Appl.
14
,
054023
(
2020
).
16.
S. J.
Whiteley
,
G.
Wolfowicz
,
C. P.
Anderson
,
A.
Bourassa
,
H.
Ma
,
M.
Ye
,
G.
Koolstra
,
K. J.
Satzinger
,
M. V.
Holt
,
F. J.
Heremans
,
A. N.
Cleland
,
D. I.
Schuster
,
G.
Galli
, and
D. D.
Awschalom
,
Nat. Phys.
15
,
490
(
2019
).
17.
H.
Chen
,
N. F.
Opondo
,
B.
Jiang
,
E. R.
MacQuarrie
,
R. S.
Daveau
,
S. A.
Bhave
, and
G. D.
Fuchs
,
Nano Lett.
19
,
7021
(
2019
).
18.
J.
Chan
,
T. M.
Alegre
,
A. H.
Safavi-Naeini
,
J. T.
Hill
,
A.
Krause
,
S.
Gröblacher
,
M.
Aspelmeyer
, and
O.
Painter
,
Nature
478
,
89
(
2011
).
19.
A. H.
Safavi-Naeini
,
J.
Chan
,
J. T.
Hill
,
T. P. M.
Alegre
,
A.
Krause
, and
O.
Painter
,
Phys. Rev. Lett.
108
,
033602
(
2012
).
20.
J.
Bochmann
,
A.
Vainsencher
,
D. D.
Awschalom
, and
A. N.
Cleland
,
Nat. Phys.
9
,
712
(
2013
).
21.
A.
Vainsencher
,
K.
Satzinger
,
G.
Peairs
, and
A.
Cleland
,
Appl. Phys. Lett.
109
,
033107
(
2016
).
22.
S.
Hong
,
R.
Riedinger
,
I.
Marinković
,
A.
Wallucks
,
S. G.
Hofer
,
R. A.
Norte
,
M.
Aspelmeyer
, and
S.
Gröblacher
,
Science
358
,
203
(
2017
).
23.
R.
Riedinger
,
A.
Wallucks
,
I.
Marinković
,
C.
Löschnauer
,
M.
Aspelmeyer
,
S.
Hong
, and
S.
Gröblacher
,
Nature
556
,
473
(
2018
).
24.
G. S.
MacCabe
,
H.
Ren
,
J.
Luo
,
J. D.
Cohen
,
H.
Zhou
,
A.
Sipahigil
,
M.
Mirhosseini
, and
O.
Painter
,
Science
370
,
840
(
2020
).
25.
H.
Ren
,
M. H.
Matheny
,
G. S.
MacCabe
,
J.
Luo
,
H.
Pfeifer
,
M.
Mirhosseini
, and
O.
Painter
,
Nat. Commun.
11
,
3373
(
2020
).
26.
A.
Bienfait
,
Y. P.
Zhong
,
H.-S.
Chang
,
M.-H.
Chou
,
C. R.
Conner
,
É.
Dumur
,
J.
Grebel
,
G. A.
Peairs
,
R. G.
Povey
,
K. J.
Satzinger
, and
A. N.
Cleland
,
Phys. Rev. X
10
,
021055
(
2020
).
27.
A.
Romanenko
,
R.
Pilipenko
,
S.
Zorzetti
,
D.
Frolov
,
M.
Awida
,
S.
Belomestnykh
,
S.
Posen
, and
A.
Grassellino
,
Phys. Rev. Appl.
13
,
034032
(
2020
).
28.
K. J.
Satzinger
,
C. R.
Conner
,
A.
Bienfait
,
H.-S.
Chang
,
M.-H.
Chou
,
A. Y.
Cleland
,
É.
Dumur
,
J.
Grebel
,
G. A.
Peairs
,
R. G.
Povey
,
S. J.
Whiteley
,
Y. P.
Zhong
,
D. D.
Awschalom
,
D. I.
Schuster
, and
A. N.
Cleland
,
Appl. Phys. Lett.
114
,
173501
(
2019
).
29.
V.
Felmetsger
,
P.
Laptev
, and
S.
Tanner
,
J. Vac. Sci. Technol., A
27
,
417
(
2009
).
30.
J. D.
Larson
,
J.
Ruby
,
R.
Bradley
,
J.
Wen
,
S.-L.
Kok
, and
A.
Chien
, in
IEEE Ultrasonics Symposium. Proceedings. An International Symposium
(
IEEE
,
2000
),Vol.
1
, pp.
869
874
.
31.
J.
Koch
,
T. M.
Yu
,
J.
Gambetta
,
A. A.
Houck
,
D. I.
Schuster
,
J.
Majer
,
A.
Blais
,
M. H.
Devoret
,
S. M.
Girvin
, and
R. J.
Schoelkopf
,
Phys. Rev. A
76
,
042319
(
2007
).
32.
R.
Barends
,
J.
Kelly
,
A.
Megrant
,
D.
Sank
,
E.
Jeffrey
,
Y.
Chen
,
Y.
Yin
,
B.
Chiaro
,
J.
Mutus
,
C.
Neill
,
P.
O'Malley
,
P.
Roushan
,
J.
Wenner
,
T. C.
White
,
A. N.
Cleland
, and
J. M.
Martinis
,
Phys. Rev. Lett.
111
,
080502
(
2013
).
33.
G.
Andersson
,
A. L. O.
Bilobran
,
M.
Scigliuzzo
,
M. M.
de Lima
,
J. H.
Cole
, and
P.
Delsing
, arXiv:2002.09389 (
2020
).
34.
E. A.
Wollack
,
A. Y.
Cleland
,
P.
Arrangoiz-Arriola
,
T. P.
McKenna
,
R. G.
Gruenke
,
R. N.
Patel
,
W.
Jiang
,
C. J.
Sarabalis
, and
A. H.
Safavi-Naeini
, arXiv:2010.01025 (
2020
).
35.
A.
Megrant
,
C.
Neill
,
R.
Barends
,
B.
Chiaro
,
Y.
Chen
,
L.
Feigl
,
J.
Kelly
,
E.
Lucero
,
M.
Mariantoni
,
P. J.
O'Malley
 et al,
Appl. Phys. Lett.
100
,
113510
(
2012
).
36.
W.
Renninger
,
P.
Kharel
,
R.
Behunin
, and
P.
Rakich
,
Nat. Phys.
14
,
601
(
2018
).
37.
V. J.
Gokhale
,
B. P.
Downey
,
D. S.
Katzer
,
N.
Nepal
,
A. C.
Lang
,
R. M.
Stroud
, and
D. J.
Meyer
,
Nat. Commun.
11
(
1
),
2314
(
2020
).