The minority carrier lifetime (τMC) and equilibrium electron concentration (i.e., the doping level, n0) are both important values that directly determine diffusion current in infrared photodetectors utilizing n-type absorbing regions. Here, time-resolved microwave reflectance measurements are used to non-destructively measure both of these values in mid-wave infrared InAs/InAs1xSbx type-II superlattices with varying n-type doping levels between 2×1014 cm−3 and 2×1016 cm−3. The measured data are analyzed using carrier recombination theory to determine the doping level ranges where Shockley-Read-Hall (SRH), radiative, and Auger recombination limit τMC. The optimal doping level, which minimizes dark current, is experimentally determined and corresponds to the electron density at which τMC switches from SRH limited to Auger limited behavior. A comparison of two InAs/InAs1xSbx photodetectors of different equilibrium electron densities demonstrates a decrease in dark current for a doping level near the optimal n0τMC product.

The minority-carrier lifetime (τMC) and the electron doping density (n0) are crucial parameters that determine the performance of infrared (IR) photodetectors.1,2 For a diffusion current-dominated photodetector, the dark current is inversely proportional to the product n0τMC, and described as3 

(1)

where ni is the intrinsic carrier density, q is the electron charge, and W is either the absorber thickness or hole diffusion length, whichever is shorter. It can be seen from Eq. (1) that high doping levels and long minority carrier lifetimes would minimize diffusion current. However, since τMC is dependent on multiple carrier recombination mechanisms, all of which scale differently with n0, there is a value of n0 that minimizes dark diffusion current.

As HgCdTe (MCT) photodetector performance has shown limited progress in recent years,4 new materials become imperative for the continual growth of IR detection. Through recent advancements, type-II superlattices (T2SLs) have shown potential for use as photodetectors. Auger suppression in InAs/Ga1xInxSb superlattices has been theorized and shown experimentally to be significant enough to surpass the dark current performance of MCT.5–7 However, this material system has been limited by parasitic Shockley-Read-Hall (SRH) defects resulting in short minority carrier lifetimes.8–10 Due to the limitations of this native parasitic defect, other T2SL materials have been investigated, such as InAs/InAs1xSbx. Long τMC values have been achieved in InAs/InAs1xSbx T2SL structures11–13 showing potential for use in IR detectors. A previous study by Höglund et al.14 has presented the n0τMC product over the doping range of 1.2×1015 cm−34.5×1015 cm−3 in InAs/InAs1xSbx T2SLs. However, a systematic study over a much larger doping range is still lacking. The study presented in this Letter investigates carrier lifetimes in mid-wave infrared (MWIR) InAs/InAs1xSbx T2SLs over the doping range 2×1014 cm−32×1016 cm−3 to determine the optimum n0τMC product. Dark current in two InAs/InAs1xSbx photodetectors of different dopings (2×1014 cm−3 and 7.5×1015 cm−3) are shown, demonstrating a reduction in dark current by optimizing the doping level.

We first conduct a survey of not intentionally doped (nid) and intentionally doped MWIR InAs/InAs1xSbx T2SL material grown at Sandia National Laboratories with 100 K bandgap energies between 215 meV (5.76 μm) and 250 meV (4.96 μm). From this list, samples are screened based on both τMC and n0. The samples with the longest lifetimes at a particular doping level have been kept, as these present current limiting performance, resulting in the fourteen samples reported here. All samples are grown using molecular beam epitaxy on slightly n-type GaSb substrates. Absorber regions are approximately 4 μm thick. Appropriate cladding layers are present in all structures to ensure the measured minority carrier lifetimes are reflective of the narrow-bandgap T2SL region and not of carrier leakage into the substrate or surface recombination. In order to achieve doping above nid levels, either Si or Te is used as intentional n-type dopants. No significant effect on the resulting minority carrier lifetime is observed between the use of the two different dopants, and we do not differentiate between the samples with Si or Te doping in this Letter. Compositions for the InAs1xSbx alloy layer of the T2SL structure range from approximately 30% to 50% Sb.

Minority carrier lifetimes and doping levels are measured using the time-resolved microwave reflectance (TMR) apparatus described by Olson et al.2 This apparatus utilizes a 5 ns pulsed IR laser to optically inject charge carriers into the T2SL absorbing layer of the sample under test. For these measurements, substrate side illumination at the wavelength of 3.7 μm with a e1 radius of 2.7 mm was used. The resulting carrier recombination decay is probed by 95 GHz continuous-wave microwave radiation reflected from the sample. The instantaneously excited carrier density is directly related to the reflected microwave power at a particular time through the change in sample conductivity that arises when the T2SL is perturbed from equilibrium. TMR data are collected and analyzed in the manner described previously in Ref. 2, 15, and 16, resulting in carrier lifetimes as a function of excited carrier density (Δn).

Representative lifetime data from three T2SL samples of different doping levels are shown in Fig. 1. All data presented are taken at 125 K and fit using an equation that takes into account SRH, radiative, and Auger recombination as2 

(2)

where τSRH is the SRH lifetime, Br is the intrinsic radiative recombination coefficient, ϕ is the photon recycling factor, and Cn is the electron Auger recombination coefficient. It is assumed that the Auger-1 recombination process dominates over the Auger-7 process.2,15 For n-type doping, the SRH lifetime dependence on Δn and n0 is

(3)

where τp0 and τn0 are the characteristic hole and electron SRH lifetimes.17 Note the doping level is explicitly taken into account in the fitting of the carrier lifetime data. Using Eqs. (2) and (3) to fit the measured carrier lifetime data allows for accurate determination of τSRH, the ratio Br/ϕ, Cn, and n0. The minority carrier lifetime is found using Eq. (2) with Δnn0.

FIG. 1.

Instantaneous carrier lifetime as a function of excess carrier density for three n-type mid-wave infrared InAs/InAs1xSbx type-II superlattice samples at a temperature of 125 K. The equilibrium electron concentrations (i.e., the net doping level) and carrier lifetimes are determined from fits to the lifetime data (black curves).

FIG. 1.

Instantaneous carrier lifetime as a function of excess carrier density for three n-type mid-wave infrared InAs/InAs1xSbx type-II superlattice samples at a temperature of 125 K. The equilibrium electron concentrations (i.e., the net doping level) and carrier lifetimes are determined from fits to the lifetime data (black curves).

Close modal

More conventional carrier density measurement methods do exist, such as capacitance-voltage (C-V) and Hall measurements.18 However, these require device fabrication steps in order to make electrical contact to the material. C-V measurements in particular, can also be highly dependent on the device architecture and geometry, and can be affected by parasitic capacitances. Extracting carrier concentrations from C-V data relies on accurate knowledge of the material's dielectric constant, which is not well known for T2SLs.2,16 Here, since we measure carrier lifetimes with very high fidelity at excited carrier densities both greater than and much less than the net doping level, accurate extraction of the doping level can be made from fitting carrier lifetime data. Uncertainty in the extracted doping level using this technique is dependent on the calibration of the initial optically injected carrier densities, which rely on accurate measurements of the pump energy and spot size, the superlattice absorption coefficient, and the assumption that every photon absorbed by the T2SL creates an electron-hole pair. This technique also requires the Auger recombination rate to be within a range where doping density has enough influence to be measurable. For example, if the Auger rate is too small then the doping level will have little significance on the carrier lifetime leading to difficulty in extraction. The absorption coefficients in this work are calculated using 14-band k·p software (SLKdp, QuantCAD LLC). The estimated error in doping levels extracted from these high-fidelity lifetime data is approximately a factor of 2, which is similar to expected errors from such methods as C-V analysis. TMR also has the benefit of being completely non-contact and non-destructive, and does not require additional fabrication. For the three T2SL samples presented in Fig. 1, the extracted doping levels from lifetime fitting are 1.6×1015 cm−3, 4.0×1015 cm−3, and 8.4×1015 cm−3 with corresponding minority carrier lifetimes of 5.73 μs, 1.69 μs, and 0.68 μs, respectively.

Repeating the described fitting procedure for the fourteen different T2SL samples in this study, a relationship between minority carrier lifetime and doping density is found, shown in Fig. 2 where the uncertainty in the minority carrier lifetime measurement is represented by the symbol size. In order to quantitatively investigate the dependence that τMC has with n0, these data are analyzed using carrier recombination theory involving SRH, radiative, and Auger recombination. The minority carrier lifetime can be written as19 

(4)

where τSRHi is the SRH lifetime for the i-th defect level, τrad is the radiative lifetime, and τAuger is the Auger lifetime. Typically, when considering nid material, it is realistic to assume a single SRH defect level;2 however, this may not necessarily be the case for intentionally doped T2SLs. Previous work by Olson et al.19 assumed a unique SRH defect level associated with the intentional dopant and found this SRH level to be approximately 70 ± 10 meV into the T2SL bandgap, compared to 130 ± 20 meV for the native SRH defect center. Thus, we assume that there are two unique SRH defect levels with associated SRH lifetimes for this analysis: one from the native defect that is independent of the doping level (τSRH1) and a second created by the intentional dopant atoms (τSRH2) that is dependent on the doping level.

FIG. 2.

Measured minority carrier lifetimes as a function of doping density at a temperature of 125 K. The solid black curve is the best fit to data, where τMC1=τSRH11+τSRH21+τrad1+τAuger1. The dashed, short-dashed, and dashed-dotted curves correspond to the individual lifetimes of the various carrier recombination mechanisms that have been identified to contribute to the total minority carrier lifetime. τSRH1 is identified as the SRH lifetime associated with a native defect present in the T2SL material system and τSRH2 is an SRH lifetime that scales with the intentional doping level.

FIG. 2.

Measured minority carrier lifetimes as a function of doping density at a temperature of 125 K. The solid black curve is the best fit to data, where τMC1=τSRH11+τSRH21+τrad1+τAuger1. The dashed, short-dashed, and dashed-dotted curves correspond to the individual lifetimes of the various carrier recombination mechanisms that have been identified to contribute to the total minority carrier lifetime. τSRH1 is identified as the SRH lifetime associated with a native defect present in the T2SL material system and τSRH2 is an SRH lifetime that scales with the intentional doping level.

Close modal

The SRH lifetime is a complicated function of characteristic lifetimes and various carrier densities. However, at 125 K, the majority electron concentration is the largest carrier density and τSRH=τp0, for the case of n-type material with low injection. With these considerations, Eq. (4) becomes

(5)

where τp01 corresponds to the SRH lifetime of the native defect and τp02 corresponds to the defect created by the intentional dopant. While τp01 is considered independent from the doping level (since the associated trap concentration is determined by factors other than the doping concentration), it is assumed τp02 scales with n0. In general,

(6)

where σp is the hole defect capture cross-section, νp is the hole thermal velocity, and Nt is the trap density. The simplest case for τp02 is to assume uncompensated doping, and that every dopant atom creates an SRH recombination center, so that Nt=n0. Prior to fitting the data in Fig. 2, the intrinsic radiative recombination coefficient is fixed based on results from Ref. 2, which calculates Br=1.01×1010 cm3/s and provides experimental evidence that ϕ=15 for similar MWIR InAs/InAs1xSbx T2SLs. The thermal hole velocity used is 2×107 cm/s, determined using a k·p-calculated density-of-states heavy hole mass of 0.157m0. With these parameters, the measured minority carrier lifetime data are best represented using τp01 = 10 μs, σp2=1.7×1018 cm2, and Cn=1.6×1026 cm6/s. The Auger coefficient is consistent with those experimentally measured in MWIR InAs/InAs1xSbx T2SLs of similar bandgap and composition.20 The exact T2SL structure has been shown to slightly affect Auger resonances,20 because this sample survey includes a range of alloy compositions; the Auger coefficient reported here can be considered an average.

Eq. (5) shows the dependence that minority carrier lifetime has with doping level, and highlights the importance of identifying not only the limiting carrier recombination mechanism but also the optimal doping level. For instance, combining Eq. (1) with an Auger-limited minority carrier lifetime (i.e., τMC1/(Cnn02)) causes the diffusion current to increase with greater doping level, as shown in Fig. 3 by the decrease in n0τMC associated with the Auger component. It is readily observed that the ideal doping density for minimizing dark diffusion current is n02.5×1015cm3, the doping level at which n0τMC reaches a maximum. The individual recombination components identified in Fig. 2 have also been translated into Fig. 3 to highlight where each mechanism limits the n0τMC product. This maximum in the experimental n0τMC product coincides with the transition point from being limited by native defects (SRH1) to Auger recombination. Clearly, the native defects are a hindrance to attaining larger n0τMC products at doping levels lower than n0=2.5×1015 cm−3. Continued efforts to mitigate native defects in InAs/InAs1xSbx T2SLs are therefore warranted. A secondary limitation arises from the intentional dopants and τSRH2, which would begin to limit the n0τMC product if the native defects are mitigated. However, little is known about how dopants are assimilated into the T2SL structures. Continued research is necessary to verify that intentional dopants do, indeed, create SRH recombination centers in the T2SL materials.

FIG. 3.

Product of n0τMC as a function of doping density at a temperature of 125 K. The solid black curve is a best fit to the data using the same fit parameters as in Fig. 2. The colored curves correspond to the individual carrier recombination mechanism that makes up the total n0τMC product. SRH1 and SRH2 correspond to the SRH recombination associated with native defects and defects created by intentional dopants, respectively.

FIG. 3.

Product of n0τMC as a function of doping density at a temperature of 125 K. The solid black curve is a best fit to the data using the same fit parameters as in Fig. 2. The colored curves correspond to the individual carrier recombination mechanism that makes up the total n0τMC product. SRH1 and SRH2 correspond to the SRH recombination associated with native defects and defects created by intentional dopants, respectively.

Close modal

For doping levels greater than n0=2.5×1015 cm−3, Auger recombination is the limiting mechanism. Previous studies on the effects of layer thickness and alloy composition in MWIR InAs/InAs1xSbx T2SLs indicate that only minor suppression of Auger recombination is possible while still attaining an approximate 5.2 μm bandgap and keeping strain balanced,21 suggesting that further improvement of n0τMC at higher doping levels may prove difficult for this wavelength range. Improvements in the Auger recombination will likely require additional materials to be used in the formation of the T2SL structure, such as the recent demonstration of InGaAs/InAsSb superlattices,22 in order to provide greater versatility in manipulation of the electronic band structure to suppress Auger resonances.

Fig. 4(a) shows the dark current as a function of bias voltage at various temperatures for two MWIR InAs/InAs1xSbx photodetectors. One has a nid absorber (2×1014 cm−3) and the second is intentionally doped at a level of 7.5×1015 cm−3. Both have 4 μm thick T2SL absorbing layers of similar bandgap energies, 231 meV for the nid sample and 219 meV for the doped sample at 100 K. The minority carrier lifetime was measured to be 9.93 μs for the nid sample and 0.97 μs for the higher doped sample at 125 K. Minimal variation in the minority carrier lifetime and doping level within the temperature range of 100–200 K has been shown previously.2,19 The doping levels have been confirmed using the TMR analysis described here. All other device structure layers are nominally the same. Arrhenius plots are shown in Fig. 4(b) for a voltage of −0.2 V. Experimental data is compared to generalized temperature trends of diffusion current (JdiffT3eEg/kBT).15 The nid sample shows slight differences with this temperature trend, which are most likely due to contributions of generation-recombination (G-R) current. An in-depth analysis of G-R current in InAs/InAs1xSbx T2SLs can be found in Ref. 23.

FIG. 4.

(a) Dark current as a function of bias voltage for two MWIR InAs/InAs1xSbx photodetectors of different doping levels, for temperatures of 160 to 200 K in steps of 20 K, 225 K, and 250 K. The lowest curves for each sample correspond to 160 K and the highest curves to 250 K. Negative voltages correspond to reverse bias. (b) Arrhenius plots for a bias of −0.2 V. The solid curves correspond to temperature trends of diffusion current.

FIG. 4.

(a) Dark current as a function of bias voltage for two MWIR InAs/InAs1xSbx photodetectors of different doping levels, for temperatures of 160 to 200 K in steps of 20 K, 225 K, and 250 K. The lowest curves for each sample correspond to 160 K and the highest curves to 250 K. Negative voltages correspond to reverse bias. (b) Arrhenius plots for a bias of −0.2 V. The solid curves correspond to temperature trends of diffusion current.

Close modal

The diffusion current component of the dark current, which is dominant at temperatures above 160 K for each sample, is shown to be suppressed in the higher doped T2SL. The n0τMC product of the two presented samples is 7.27×109 cm−3s for the higher doped sample and 2×109 cm−3s for the nid sample. Taking into account the difference in ni of the two samples due to differences in bandgap energy at 200 K, the calculated diffusion current ratio is 1.8 while the measured ratio is 2, demonstrating a close agreement.

In summary, time-resolved microwave reflectance was used to extract both minority carrier lifetimes and doping levels for MWIR InAs/InAs1xSbx T2SLs over a range of doping levels. The minority carrier lifetime is found to be dominated by Auger recombination at high doping concentrations, n0>2.5×1015 cm−3, and Shockley-Read-Hall recombination through native defects at low doping concentrations, n0<2.5×1015 cm−3. We do not find that radiative recombination impacts the carrier lifetime significantly. For optimal reduction in dark diffusion current the n0τMC product must be at a maximum, which was found at a doping level of n02.5×1015cm3. This maximum lies at the transition between SRH limited behavior from native defects at lower doping levels and Auger recombination at higher doping levels. Depending on the targeted doping level, further reduction in dark diffusion current (greater n0τMC products) will require mitigation of native SRH defects or suppressing Auger recombination through engineering of the electronic band structure.

Sandia National Laboratories is a multi-program laboratory managed and operated by Sandia Corporation, a wholly owned subsidiary of Lockheed Martin Corporation, for the U.S. Department of Energy's National Nuclear Security Administration under contract DE-AC04-94AL85000. This work was supported by the U.S. Department of Energy, Office of Science, Basic Energy Sciences, Materials Sciences and Engineering Division.

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