Device architectures based on the two-dimensional material graphene can be used for sensing of electromagnetic and particle radiation. The sensing mechanism may be direct, by absorbance of radiation by the graphene or the immediately adjacent material, and indirect, via the field effect principle, whereby the change in conductivity within a semiconducting absorber substrate induces electric field change at graphene. Here, we report on a graphene field effect transistor (GFET) sensitive to heavy charged particle radiation (α particles) at MeV energies by use of the indirect sensing mechanism. Both the continuous and discrete changes of graphene are observed, and the latter are attributed to single α particle interactions with the GFET. While this study provides the basis for understanding of the irradiation effects, it also opens prospects for the use of GFETs as heavy charged particle detectors.
Graphene's sensitivity to changes in the local electric field makes it a promising material for implementation in a variety of sensor architectures.1–3 It has been demonstrated that the unique properties of graphene can be used to develop graphene-based sensors to detect molecules, including those relevant for biochemical processes,4–9 low-energy electromagnetic radiation,10–16 and ionizing radiation, such as electrons, X rays, and gamma rays.17–22
Graphene can be used as a direct or indirect sensor. Direct sensing relies on the direct interaction of radiation, atoms, or compounds with the graphene, for example, by absorption,23–28 or with a material immediately adjacent to graphene, such as a quantum dot or a nanomaterial layer deposited on graphene.29–33 In these architectures, graphene current is modulated by the excitation of electrons within graphene or in the nanomaterial immediately adjacent to graphene.34–36 In contrast, indirect sensing relies on the interaction of penetrating radiation with an underlying semiconducting substrate. In this approach, graphene is placed on a back-gated undoped semiconductor substrate in a graphene field effect transistor (GFET), as shown in Fig. 1(a). The energy deposited by the radiation modifies the conductivity of the substrate by production of electron-hole pairs, which are then transported within the substrate. The modification of substrate conductivity modulates the graphene current via the field effect principle, whereby the measured graphene current is sensitive to changes in the local electric field.37–39
(a) Back-gated GFET on the undoped SiC substrate. Application of gate voltage creates an electric field within the substrate. (b) Enlargement section of Fig. 1(a) showing the shape of the electric field under graphene. (c) A 3-MeV α particle deposits energy and modifies conductivity along its path. Conductivity change increases electric field strength at graphene, inducing the field effect.
(a) Back-gated GFET on the undoped SiC substrate. Application of gate voltage creates an electric field within the substrate. (b) Enlargement section of Fig. 1(a) showing the shape of the electric field under graphene. (c) A 3-MeV α particle deposits energy and modifies conductivity along its path. Conductivity change increases electric field strength at graphene, inducing the field effect.
Graphene-based devices have been used to sense photons, molecules, and high fluxes of charged particles by observing the graphene properties change due to its damage.17,40–44 However, the interaction of heavy charged particles with the GFET at relatively low particle fluxes (on the order of 103 cm−2 s−1 and lower) and high energies (on the order of MeV) has not been studied to date. Here, we investigate the effect of alpha (α) particle irradiation on the electrical response of a GFET. We first examine the graphene current response to α particle exposure at positive and negative gate polarities for two different radioactive sources. Next, we reveal the discrete step-like response of graphene, attributed to single α particle interaction, particularly for the negative gate polarity. Finally, we employ a simple electronic device model and Monte Carlo simulation to support the conclusions made from experimental measurements.
In a GFET, α particles are detected by measuring the change of the graphene current, Isd, which occurs when the conductivity of the substrate is modified by ionization from α particle depositions in the substrate. The GFET studied in this work consists of graphene on a back-gated substrate. The dimensions of graphene are 20 × 4 μm2 (see supplementary material Section I for additional information on GFET fabrication). The change of substrate conductivity acts to modify the electric field that is present in the vicinity of graphene, as illustrated in Figs. 1(b) and 1(c), before and after a single α particle absorption, respectively. For a change in graphene current to be attributed to α particles and be distinguishable from noise, the magnitude of the field effect must be sufficiently large. The magnitude of the field effect is dependent on the rate of α particle absorption in the substrate, the location of α particle absorption relative to the graphene, and the energy of the α particles.
Time-dependent, Isd – t, and voltage-dependent, Isd – Vg, measurements were conducted, which are used to evaluate the GFET response to α particle absorption and survey the field effect characteristics of the GFET. Measurement results with exposure to a 210Po source and 241Am source are shown in Fig. 2(a). These field effect measurements were taken after stabilization of the field effect or continuous exposure to 241Am and 210Po sources at Vg = −60 V for 5 min and 3 h, respectively. A greater field effect was observed when the higher activity (241Am) α source was used. This is expected due to the greater change of substrate conductivity as the rate of ionization in the substrate is increased. As shown in Fig. 2(b), the difference in field effect characteristics for non-exposure and exposure to the 210Po source at Vg = −40 V is measurable; the magnitude of this difference is important in interpretation of single α absorption events. The gate voltage at which all the field effect curves intercept is expected to be Vg = 0 V. Due to a possible combination of the effect of built-up charge in the substrate and doping of graphene by the ambient environment and during fabrication, the intercept gate voltage is shifted to positive Vg, whereby an additional application of electric field is required to induce an effective zero doping in graphene.45–48
(a) Graphene field effect when unexposed and exposed to 241Am and 210Po α particle sources is shown. (b) An enlarged view from the dotted box in (a) shows a negligible field effect with GFET unexposed and field effect due to 210Po α source exposure. A blue dotted line provides a linear fit to the Isd – Vg measurement with 210Po exposure in the range of −55 V < Vg < −25 V.
(a) Graphene field effect when unexposed and exposed to 241Am and 210Po α particle sources is shown. (b) An enlarged view from the dotted box in (a) shows a negligible field effect with GFET unexposed and field effect due to 210Po α source exposure. A blue dotted line provides a linear fit to the Isd – Vg measurement with 210Po exposure in the range of −55 V < Vg < −25 V.
Time-dependent measurements of graphene current resulted in a greater rate of change of Isd when GFET was exposed to the higher activity 241Am source compared to the lower activity 210Po source, as shown in Figs. 3(a) and 3(b). Also, as predicted from the field effect characteristic measurements, Isd – Vg, a greater rate of change of graphene current is observed for negative gate voltages. The total exposure times of the GFET were 35 min and 11 h for the 241Am and the 210Po source, respectively.
Isd – t measurements for exposure over (a) 5 min (t = 5–10 min) to the 241Am α source and (b) 3 h (for t > 10 min) to the 210Po α source. (c) Time derivative of Isd – t measurements, with GFET exposed to 241Am α source for Vg = −40 V shows positive spikes, indicating positive changes in Isd, attributed to α particle energy deposition into the substrate. (d) For time derivative of Isd – t measurements with 210Po α source exposure for Vg = −40 V, discrete positive spikes are attributed to single α particle energy depositions into the substrate under or near graphene.
Isd – t measurements for exposure over (a) 5 min (t = 5–10 min) to the 241Am α source and (b) 3 h (for t > 10 min) to the 210Po α source. (c) Time derivative of Isd – t measurements, with GFET exposed to 241Am α source for Vg = −40 V shows positive spikes, indicating positive changes in Isd, attributed to α particle energy deposition into the substrate. (d) For time derivative of Isd – t measurements with 210Po α source exposure for Vg = −40 V, discrete positive spikes are attributed to single α particle energy depositions into the substrate under or near graphene.
As shown in Fig. 3(b), during measurements at Vg = −40 V with the 210Po source exposure, Isd exhibits discrete increasing steps. These discrete steps are shown in detail in supplementary material Section V. When the time derivative of the time-dependent current is calculated, the relatively fast and large step changes in Isd are made more apparent and appear as spikes, as in Fig. 3(d). The discrete steps in Isd are attributed to individual α particles depositing their energy directly under or near the edge of the graphene, which is corroborated by the following analysis: first, the electric field in the sensitive region of the substrate near graphene is modeled; second, energy deposition spectra of α particles expected in this sensitive region are calculated. The slow recovery of graphene current after α particle exposure is likely due to doping of graphene.
The electric field in the GFET was modeled using the COMSOL Multiphysics framework.49 A region of modified conductivity was defined corresponding to energy deposition by a 3-MeV α particle, which is a typical energy deposited in the substrate by α particles from the 210Po source, accounting for energy loss in air in our experiment and the source energy spectrum (a range of 1.88 cm is calculated for a 5 MeV α particle slowing to 3 MeV in air). Additional information about the model and related calculations is provided in supplementary material Section III. As shown in Fig. 1(c), when the modified conductivity region is present, the electric field lines are partially diverted toward the region where the α particle deposits its energy and where the conductivity is increased, and then toward graphene. To quantify the effect of this reconfiguration of the electric field near graphene, the average electric field along the width of graphene is plotted as a function of the distance (x) of the modified conductivity region from the center under graphene, x = 0 μm (Fig. 4(c)).
Distribution of the time derivative of the Isd – t measurement with GFET exposure to (a) the 241Am α source (total experimental time, te = 35 min) and (b) the 210Po α source (te = 11 h). (c) The plot shows modification to electric field by 3-MeV α particle energy deposition for one half of the graphene (graphene center at 0 μm and the edge at 2 μm). (d) Simulated energy deposition spectra in the effective area of graphene for time, te, with exposure to 241Am (unfilled circles) and 210Po (filled circles) α sources.
Distribution of the time derivative of the Isd – t measurement with GFET exposure to (a) the 241Am α source (total experimental time, te = 35 min) and (b) the 210Po α source (te = 11 h). (c) The plot shows modification to electric field by 3-MeV α particle energy deposition for one half of the graphene (graphene center at 0 μm and the edge at 2 μm). (d) Simulated energy deposition spectra in the effective area of graphene for time, te, with exposure to 241Am (unfilled circles) and 210Po (filled circles) α sources.
The electric field at graphene maintains an increased magnitude when energy deposition occurs under graphene but drops rapidly at the edge of graphene (x = 2 μm in Fig. 4(c)). The electric field reaches the magnitude equal to that when no modified conductivity region is present at a relatively small distance from the center of graphene, x ≈ 3 μm. These characteristic distances obtained from the two-dimensional model and shown in Fig. 4(c) correspond to the width of graphene in our GFET (2 μm); the model was also applied to the orthogonal dimension (graphene length, 20 μm), obtaining the result that the electric field is increased up to several μm from outside the edge of graphene. Thus, the area over which the GFET is sensitive to ionization extends over the region −3 ≲ x ≲ 3 μm (along graphene width) and −15 ≲ y ≲ 15 μm (along graphene length), or approximately as far as half of the graphene width or length beyond the edge of graphene. We define the highly sensitive region as −2.1 < y < 2.1 μm (along graphene width) and −10.25 < x < 10.25 μm (along graphene length) corresponding to a sensitive area of 20.5 × 4.2 μm2. This represents an area within which the electric field is modified by >50% of the difference between the electric field at the center of graphene (x = 0 μm) and the electric field at x = 3 μm, corresponding to no modification of the electric field due to α exposure.
The occurrence of single α particle sensing can be further supported by the analysis of the discrete step changes in Isd (Figs. 3(b) and 3(d)), the field effect measurements (Fig. 2(b)), and the electric field model (Fig. 4(c)). The change of the electric field due to a single discrete absorption event in experiment can be determined from the change in graphene current and compared to the modeled change in electric field due to single α particle absorption. The change in electric field due to α particle absorption in Fig. 4(c) is ≈1.4 × 106 V/m or ≈24%. At Vg = −40 V, a 24% change of electric field would correspond to a change of back-gate voltage of approximately −10 V. The effect of this change of back-gate voltage on the current through graphene (Isd) can then be estimated from the independently measured Isd – Vg characteristic when graphene is exposed to the 210Po source (Fig. 2(b)). A linear fit, Isd = a + bVg, with fit parameters of a = 1.02 × 105 A and b = −1.367 × 109 A V−1, is obtained from the Isd – Vg measurement in the range −55 V < Vg < −25 V. Typical large discrete steps of Isd in Fig. 3(b) can be estimated as ≈1.5 × 10−8 A. Using the linear fit, a discrete step change of Isd = 1.5 × 10−8 A corresponds to a back-gate voltage change ΔVg ≈ −11 V, which is of the order of the change in Vg predicted from the correlation of the electric field model (Fig. 4(c)) and Isd – Vg measurement (Fig. 2(b)). This analysis further establishes the correspondence between the electric field model to experimental Isd – t and Isd – Vg measurements and supports the conclusion that individual α particle interactions with the GFET are observed.
A Monte Carlo simulation was conducted to calculate the energy deposition spectra of α particles depositing energy under the effective area of graphene (20.5 × 4.2 μm2). Additional information on the Monte Carlo simulation is provided in supplementary material Section IV. The resulting energy deposition spectra for the region under the effective area of graphene for the α sources are shown in Fig. 4(d), and the information on the number of simulated α particles depositing energy under the effective area of graphene is given in Table I (). The number of α particles counted in the experiment is obtained from the distribution of the time derivative of the time-dependent graphene current (Isd – t), shown in Figs. 4(a) and 4(b). The simulation provides an estimate of the rate of α particle incidence onto the effective area of GFET, which can be compared to the rate of discrete steps appearing in Isd – t measurements. A good agreement is observed between the predicted (simulated) and experimentally measured rate of discrete steps appearing in the Isd – t measurement for the 210Po source at Vg = −40 V. The standard deviations are shown in the histograms of Figs. 4(a) and 4(b). The agreement further supports the hypothesis that the observed discrete steps in Isd – t when the GFET is exposed to the 210Po source are due to individual α particles depositing energy within the effective area of the GFET.
The number of α particles detected in experiment compared with simulation. is the simulated number of α particles absorbed in the substrate for measurement period te; is the number of α particles detected within the bins shown in Figs. 4(a) and 4(b) at Vg = −40 V during te. te = 35 min and te = 11 h for GFET exposure to the 241Am and 210Po α sources, respectively. The value of is calculated by summing all events (as in Fig. 4(a) or 4(b)) above a given standard deviation (noise).
. | . | . | |||
---|---|---|---|---|---|
. | . | σ . | 2σ . | 3σ . | 4σ . |
241Am | 72.1 ± 3.7 | 960 | 355 | 162 | 67 |
210Po | 22.9 ± 1.24 | 526 | 72 | 45 | 21 |
. | . | . | |||
---|---|---|---|---|---|
. | . | σ . | 2σ . | 3σ . | 4σ . |
241Am | 72.1 ± 3.7 | 960 | 355 | 162 | 67 |
210Po | 22.9 ± 1.24 | 526 | 72 | 45 | 21 |
While the discrete steps in Isd – t are discernible when the 210Po source is used, as in Figs. 3(b) and 3(d), this is not the case when the GFET is exposed to the 241Am source, as in Fig. 3(a) or 3(c). This is attributed to the difference between the energy spectra of the 210Po and 241Am sources. As shown by simulation (Fig. 4(d)), the absorbed energy spectrum from the 241Am source is weighted to lower energies, while the spectrum for the 210Po source is weighted to higher energies. Thus, when the GFET is irradiated by the 210Po source, a greater fraction of α particles incident on the GFET have the high energies needed to produce a large, discrete response. In contrast, the greater fraction of lower energy α particles emitted by the 241Am source may obscure any discrete steps that occur in Isd – t measurements. The higher incidence rate of α particles from the 241Am source induces a relatively large continuous rate of change in Isd; however, since the majority of α particles have lower energy, each particle causes only a small change of the substrate conductivity. Large numbers of such small energy depositions incrementally and collectively act to produce a significant change of conductivity. Conversely, the much lower rate of α particle absorption by the substrate when exposed to the 210Po source allows for identification of discrete steps, especially as the average energy deposited by an α particle from the 210Po source is higher. Discrete steps in Isd – t measurements are not discernible for either source when positive gate voltage is applied (Vg = +40 V), as in Fig. 3(b). This is believed to be due to the lower field effect response of the GFET for positive gate voltage (Vg = 40 V) compared to negative gate voltage (Vg = −40 V), as also observed in field effect measurements in Fig. 2, especially for the 241Am source. The greater sensitivity at negative gate voltage is believed to be due to the greater difference between the measurement voltage at Vg = −40 V and the charge neutrality point at approximately Vg = +20 V (as shown in Fig. 2(a)). Finally, measurements of a “dummy” device exposed to the 241Am source, where graphene is replaced with gold, show no response to α particle exposure, as discussed in supplementary material Section VI.
In conclusion, experiments were conducted to develop an understanding of the effect of heavy charged particle irradiation on GFET electrical response. The GFETs consist of CVD graphene on SiC substrates in a back-gated architecture. The graphene field effect and time dependent response to α particle exposure from 241Am and 210Po radioisotope sources for both positive and negative gate voltages have been studied. For both α particle sources, a greater field effect is measured for negative gate voltages (Vg), which is likely due to doping of the graphene. Time-dependent measurements show cumulative graphene current response to both 241Am and 210Po sources, with greater current response for the higher activity 241Am source. These time-dependent measurements are consistent with field effect measurements.
Of particular interest are the discrete step-like changes in graphene current when exposed to the 210Po source at negative gate voltage. These discrete changes of graphene current are attributed to absorption of individual α particles in the area directly under graphene or near the edge of graphene. An analysis was conducted that includes an electric field model and Monte Carlo simulation. The results of the analysis support the single α particle sensitivity hypothesis by predicting the magnitude of change of the electric field at graphene due to single α particle absorption under graphene comparable to that observed in the experiment. The analysis also shows that the predicted number of α particles in simulation is in agreement with the number of discrete changes in graphene current for the 210Po source.
Future work should focus on detailed experimental quantification of the dependence of discrete graphene current changes on the energy depositions of single charged particles in a GFET. To accurately perform such experiments, a monoenergetic particle source with ability to control both the particle energy and particle flux is desirable.
The experiments and analyses conducted within this work advance the understanding of charged particle interaction with GFETs and represent a step toward the utilization of graphene-based devices as ionizing radiation sensors operating in the pulse (single event) mode. GFETs could provide benefits of scalability to large sizes while maintaining low-power operation. In addition to the established sensing of electromagnetic radiation, GFETs show promise as heavy charged particle detectors for a variety of scientific and engineering applications.
See supplementary material for more detail on the GFET fabrication process, calculation of conductivity within the substrate, experimental setup, and electrical measurements. Also discussed are the Monte Carlo simulation method, testing of dummy devices, and the effects of radiation damage on graphene.
This work was funded by the Department of Homeland Security (DHS) and the National Science Foundation (NSF) through the Academic Research Initiative (ARI) (2009-DN-077-ARI036-02) and by the Defense Threat Reduction Agency (DTRA).