Mn/Cu heterostructures thermally evaporated onto and, subsequently, annealed were investigated by transmission electron microscopy related techniques in order to study the diffusion interactions which lead to barrier layer formation. Energy dispersive x-ray spectroscopy and electron energy loss spectroscopy provide evidence for the interdiffusion between the Mn and Cu layers following a anneal, where the Mn diffuses toward the surface of the structure, while Cu diffuses toward the but does not propagate into the dielectric. The chemical composition of the 2–3 nm interfacial layer is primarily a mixture of and Mn valences, in good agreement with previously reported results.
Interdiffusion and barrier layer formation in thermally evaporated Mn/Cu heterostructures on substrates
J. G. Lozano, S. Lozano-Perez, J. Bogan, Y. C. Wang, B. Brennan, P. D. Nellist, G. Hughes; Interdiffusion and barrier layer formation in thermally evaporated Mn/Cu heterostructures on substrates. Appl. Phys. Lett. 21 March 2011; 98 (12): 123112. https://doi.org/10.1063/1.3569146
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