Effective work function (EWF) changes of annealed at low temperatures in different ambient environments are correlated with the atomic concentration of oxygen in the TiN near the metal/dielectric interface. EWF increases of 550 meV are achieved with anneals that incorporate oxygen throughout the TiN with near the interface. However, further increasing the oxygen concentration via more aggressive anneals results in a relative decrease of the EWF and increase in electrical thickness. First-principles calculations indicate the exchange of O and N atoms near the interface cause the formation of dipoles that increase the EWF.
REFERENCES
1.
B. H.
Lee
, J.
Oh
, H. H.
Tseng
, R.
Jammy
, and H.
Huff
, Mater. Today
9
, 32
(2006
).2.
E. P.
Gusev
, V.
Narayanan
, and M. M.
Frank
, IBM J. Res. Dev.
50
, 387
(2006
).3.
L.
Lin
and J.
Robertson
, Microelectron. Eng.
86
, 1743
(2009
).4.
H. J.
Li
and M. I.
Gardner
, IEEE Electron Device Lett.
26
, 441
(2005
).5.
J. K.
Schaeffer
, L. R. C.
Fonseca
, S. B.
Samavedam
, Y.
Liang
, P. J.
Tobin
, and B. E.
White
, Appl. Phys. Lett.
85
, 1826
(2004
).6.
E.
Cartier
, F. R.
McFeely
, V.
Narayanan
, P.
Jamison
, B. P.
Linder
, M.
Copel
, V. K.
Paruchuri
, V. S.
Basker
, R.
Haight
, D.
Lim
, R.
Carruthers
, T.
Shaw
, M.
Steen
, J.
Sleight
, J.
Rubino
, H.
Deligianni
, S.
Guha
, R.
Jammy
, and G.
Shahidi
, 2005 Symposium on VLSI Technology, Digest of Technical Papers
, 2005
(unpublished), p. 230
.7.
B.
Chen
, R.
Jha
, H.
Lazar
, N.
Biswas
, J.
Lee
, B.
Lee
, L.
Wielunski
, E.
Garfunkel
, and V.
Misra
, IEEE Electron Device Lett.
27
, 228
(2006
).8.
J.
Lee
, H.
Park
, H.
Choi
, M.
Hasan
, M.
Jo
, M.
Chang
, B. H.
Lee
, C. S.
Park
, C. Y.
Kang
, and H.
Hwang
, Appl. Phys. Lett.
92
, 263505
(2008
).9.
E.
Cartier
, M.
Steen
, B. P.
Linder
, T.
Ando
, R.
Iijima
, M.
Frank
, J. S.
Newbury
, Y. H.
Kim
, F. R.
McFeely
, M.
Copel
, R.
Haight
, C.
Choi
, A.
Callegari
, V. K.
Paruchuri
, and V.
Narayanan
, 2009 Symposium on VLSI Technology, Digest of Technical Papers
, 2009
(unpublished), p. 42
.10.
W.
Mizubayashi
, K.
Akiyama
, W.
Wang
, M.
Ikeda
, K.
Iwamoto
, Y.
Kamimuta
, A.
Hirano
, H.
Ota
, T.
Nabatame
, and A.
Toriumi
, 2008 Symposium on VLSI Technology, Digest of Technical Papers
, 2008
, Vol. 42
, p. 61
.11.
E.
Cartier
, M.
Hopstaken
, and M.
Copel
, Appl. Phys. Lett.
95
, 042901
(2009
).12.
T. S.
Kim
, S. S.
Park
, and B. T.
Lee
, Mater. Lett.
59
, 3929
(2005
).13.
D. K.
Schroder
, Semiconductor Material and Device Characterization
, 2nd ed. (Wiley
, New York
, 1998
), pp. 356
–362
.14.
MedeA 2.3, Materials Design, Inc., Angel Fire, NM (
2008
).15.
G.
Kresse
and J.
Hafner
, Phys. Rev. B
47
, 558
(1993
).16.
G.
Kresse
and J.
Furthmüller
, Phys. Rev. B
54
, 11169
(1996
).17.
M.
Peressi
, S.
Baroni
, A.
Baldereschi
, and R.
Resta
, Phys. Rev. B
41
, 12106
(1990
).© 2010 American Institute of Physics.
2010
American Institute of Physics
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