Imaging high resolution subsurface defects nondestructively in advanced interconnect structures and devices is a challenge and no known metrology tools are available to identify such defects in a nondestructive way at nanometer level. Monitoring these defects necessitate the understanding of their growth mechanism of these interconnects as well as defect formation. We report here the application of scanning near field ultrasound holography by imaging buried defects in copper interconnects and low-K dielectric materials. Defects in these copper lines such as voids and delaminations appear as regions of dark contrast in ultrasound holography imaging due to large acoustic impedance mismatch at the voids. Identification of these buried defects in these interconnect architectures in a nondestructive way will open up unique opportunities in using this technique to detect subsurface defects and material imperfections.
Skip Nav Destination
Article navigation
28 December 2009
Research Article|
December 28 2009
Ultrasound holography for noninvasive imaging of buried defects and interfaces for advanced interconnect architectures
Gajendra Shekhawat;
Gajendra Shekhawat
a)
1International Institute for Nanotechnology and the NUANCE Center,
Northwestern University
, Evanston, Illinois 60208, USA
Search for other works by this author on:
Arvind Srivastava;
Arvind Srivastava
1International Institute for Nanotechnology and the NUANCE Center,
Northwestern University
, Evanston, Illinois 60208, USA
2Department of Material Science and Engineering,
Northwestern University
, Evanston, Illinois 60208, USA
Search for other works by this author on:
Shraddha Avasthy;
Shraddha Avasthy
2Department of Material Science and Engineering,
Northwestern University
, Evanston, Illinois 60208, USA
Search for other works by this author on:
Vinayak Dravid
Vinayak Dravid
a)
1International Institute for Nanotechnology and the NUANCE Center,
Northwestern University
, Evanston, Illinois 60208, USA
2Department of Material Science and Engineering,
Northwestern University
, Evanston, Illinois 60208, USA
Search for other works by this author on:
a)
Authors to whom correspondence should be addressed. Electronic addresses: [email protected] and [email protected].
Appl. Phys. Lett. 95, 263101 (2009)
Article history
Received:
August 05 2009
Accepted:
October 22 2009
Citation
Gajendra Shekhawat, Arvind Srivastava, Shraddha Avasthy, Vinayak Dravid; Ultrasound holography for noninvasive imaging of buried defects and interfaces for advanced interconnect architectures. Appl. Phys. Lett. 28 December 2009; 95 (26): 263101. https://doi.org/10.1063/1.3263716
Download citation file:
Pay-Per-View Access
$40.00
Sign In
You could not be signed in. Please check your credentials and make sure you have an active account and try again.
Citing articles via
Roadmap on photonic metasurfaces
Sebastian A. Schulz, Rupert. F. Oulton, et al.
Sputter epitaxy of ScAlN films on GaN high electron mobility transistor structures
Tomoya Okuda, Shunsuke Ota, et al.
Era of entropy: Synthesis, structure, properties, and applications of high-entropy materials
Christina M. Rost, Alessandro R. Mazza, et al.
Related Content
Elastic phase response of silica nanoparticles buried in soft matter
Appl. Phys. Lett. (October 2008)
Imaging of subsurface structures using atomic force acoustic microscopy at GHz frequencies
J. Appl. Phys. (April 2011)
Correlating Nanostructures with Function: Structural Colors on the Wings of a Malaysian Bee
AIP Conference Proceedings (October 2010)
SRXRF imaging of a single brain cell from a patient with Parkinson’s disease
AIP Conference Proceedings (June 1999)
Acoustic distortion in the ear canal. I. Cubic difference tones: Effects of acute noise injury
J Acoust Soc Am (May 1986)