We report that the dependence of the lifetime of hydrogenated amorphous silicon (-Si:H) thin-film transistors (TFTs) versus channel sheet resistance exhibits two distinctly different regimes. At low (high gate electric field) the lifetime is strongly dependent on , decreasing as is decreased. At high (low gate electric field), the lifetime becomes independent of . These two regimes of lifetime are dominated by different degradation mechanisms. By including hydrogen dilution in the deposition process, the extrapolated time for the 10% and 50% decay of the TFT current under dc operation in the low gate field regime can be raised to over 2 and 1000 yr, respectively.
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