A comparative study was made of the performance and electrical instabilities in amorphous indium-gallium-zinc oxide (a-IGZO) thin film transistors with Al2O3 and Al2O3/SiNx gate dielectrics. Steeper subthreshold slope is observed in Al2O3 devices, which shows that the density of trap states at the interface of a-IGZO/Al2O3 is lower than that of a-IGZO/SiNx. Under high bias-stresses, a larger degradation is observed in Al2O3/SiNx devices. The device degradation for both devices are mainly attributed to the charge trapping phenomenon, but the different time dependence of threshold voltage shift shows that trapped electrons are more easily redistributed inside the Al2O3 dielectrics.

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