The metal-insulator-metal (MIM) capacitor for analog and rf applications has been developed with laminate as the dielectric. The high capacitance density of can be achieved due to the tetragonal which makes the higher dielectric constant of 38.7. This MIM capacitor also demonstrates the quadratic voltage coefficient of and the good leakage current of at which is ascribed to the inserted . Since the Schottky emission is suggested as the major dielectric conduction mechanism, a further reduced quadratic voltage coefficient and leakage characteristic can be realized by using a high work-function electrode. The combination of the promising electrical properties and the desirable process integration renders this structure highly suitable for advanced MIM capacitors.
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21 July 2008
Research Article|
July 22 2008
High density metal-insulator-metal capacitor based on laminate dielectric
Yung-Hsien Wu;
Yung-Hsien Wu
a)
1Department of Engineering and System Science,
National Tsing-Hua University
, 300 Hsinchu, Taiwan
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Chien-Kang Kao;
Chien-Kang Kao
2Strategic Process and JDP Department,
ProMOS Technologies Inc.
, Science-Based Industrial Park, 300 Hsinchu, Taiwan
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Bo-Yu Chen;
Bo-Yu Chen
1Department of Engineering and System Science,
National Tsing-Hua University
, 300 Hsinchu, Taiwan
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Yuan-Sheng Lin;
Yuan-Sheng Lin
1Department of Engineering and System Science,
National Tsing-Hua University
, 300 Hsinchu, Taiwan
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Ming-Yen Li;
Ming-Yen Li
3Fab III Thin Film Department,
ProMOS Technologies Inc.
, 428 Taichung, Taiwan
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Hsiao-Che Wu
Hsiao-Che Wu
3Fab III Thin Film Department,
ProMOS Technologies Inc.
, 428 Taichung, Taiwan
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a)
Electronic mail: yunhwu@mx.nthu.edu.tw.
Appl. Phys. Lett. 93, 033511 (2008)
Article history
Received:
June 03 2008
Accepted:
June 22 2008
Citation
Yung-Hsien Wu, Chien-Kang Kao, Bo-Yu Chen, Yuan-Sheng Lin, Ming-Yen Li, Hsiao-Che Wu; High density metal-insulator-metal capacitor based on laminate dielectric. Appl. Phys. Lett. 21 July 2008; 93 (3): 033511. https://doi.org/10.1063/1.2958238
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