We have investigated the interfacial reaction between platinum and InGaP in a Schottky diode structure. There was a 7.5-nm-thick amorphous layer formed at the interface between Pt and InGaP after metal deposition. After annealing at 325°C for 1min, this amorphous layer increased to 12.8nm and the reverse leakage current also decreased. The diffusion of Pt atoms and the crystallization of amorphous layer took place after annealing at 325°C for 10min. Prolonging the annealing to 3h led to formation of Ga2Pt and GaPt3 phases in InGaP and Schottky diodes degraded after these new phases were observed.

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