The authors report on the rubrene polycrystalline film growth for its thin film transistor (TFT) applications. Amorphous rubrene thin film was initially obtained on 200-nm-thick SiO2Si substrate at 40°C in a vacuum chamber by thermal evaporation but in situ long time postannealing at the elevated temperatures of 6080°C transformed the amorphous phase into crystalline. Based on an optimum condition to cover the whole channel area with polycrystalline film, the authors have fabricated a rubrene TFT with a relatively high field effect mobility of 0.002cm2Vs, an on/off ratio of 104, and a low threshold voltage of 9V.

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