High-conductivity two-dimensional electron gases at heterojunctions are reported. The sheet densities can be tuned from by varying the AlN thickness from . A critical thickness is observed beyond which biaxial strain relaxation and cracking of AlN occur, and a degradation of carrier mobility is seen to occur at extremely high sheet densities. A high-mobility window is identified, within which room-temperature mobility exceeding . and sheet densities in the are obtained, yielding record low sheet resistances in the range of . Interface roughness scattering and strain relaxation are identified as the factors preventing lower sheet resistances at present.
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