Fully relaxed, high-quality Ge layers were grown directly on Si(001) substrates by surfactant-mediated epitaxy at high temperature with large Sb flux. We attribute the low dislocation densities in our films to an abrupt strain relief via the formation of a regular array of 90° dislocations at the interface during the initial, microrough stage of growth. This mechanism of abrupt strain relaxation occurs exclusively under high Sb coverage at temperatures . The high growth temperature also enhances Sb segregation leading to a low background doping level of only . Thus, we regard surfactant-mediated epitaxy of relaxed Ge on Si(001) as a promising candidate for device application.
REFERENCES
1.
M. L.
Lee
, E. A.
Fitzgerald
, M. T.
Bulsara
, M. T.
Currie
, and A.
Lochtefeld
, J. Appl. Phys.
97
, 011101
(2005
).2.
D. A.
Antoniadis
, 2002 Symposium on VLSI Technology, Digest of Technical Papers
, 11–13 June 2002, Honolulu, HI (IEEE
, NJ, 2002
), pp. 2
–5
.3.
F.
Schäffler
, Semicond. Sci. Technol.
12
, 1515
(1997
).4.
J. M.
Hartmann
, A.
Abbadie
, A. M.
Papon
, P.
Holliger
, G.
Rolland
, T.
Billon
, J. M.
Fédéli
, M.
Rouvière
, L.
Vivien
, and S.
Laval
, J. Appl. Phys.
95
, 5905
(2004
).5.
L.
Colace
, G.
Masini
, G.
Assanto
, H. C.
Luan
, K.
Wada
, and L. C.
Kimerling
, Appl. Phys. Lett.
76
, 1231
(2000
).6.
M.
Halbwax
, D.
Bouchier
, V.
Yam
, D.
Débarre
, L. H.
Nguyen
, Y.
Zheng
, P.
Rosner
, M.
Benamara
, H. P.
Strunck
, and C.
Clerc
, J. Appl. Phys.
97
, 064907
(2005
).7.
M.
Horn-von Hoegen
, F. K.
LeGoues
, M.
Copel
, M. C.
Reuter
, and R. M.
Tromp
, Phys. Rev. Lett.
67
, 1130
(1991
).8.
M.
Horn-von Hoegen
, B. H.
Müller
, and A.
Al-Falou
, Phys. Rev. B
50
, 11640
(1994
).9.
M.
Horn-von Hoegen
, M.
Copel
, J. C.
Tsang
, M. C.
Reuter
, and R. M.
Tromp
, Phys. Rev. B
50
, 10811
(1994
).10.
D.
Reinking
, M.
Kammler
, M.
Horn-von Hoegen
, and K. R.
Hofmann
, Appl. Phys. Lett.
71
, 924
(1997
).11.
K. R.
Hofmann
, D.
Reinking
, M.
Kammler
, and M.
Horn-von Hoegen
, Thin Solid Films
321
, 125
(1998
).12.
T. F.
Wietler
, E.
Bugiel
, A.
Ott
, and K. R.
Hofmann
, Mater. Sci. Semicond. Process.
8
, 73
(2005
).13.
D.
Reinking
, M.
Kammler
, N.
Hoffmann
, M.
Horn-von Hoegen
, and K. R.
Hofmann
, Electron. Lett.
35
, 503
(1999
).14.
D.
Reinking
, M.
Kammler
, N.
Hoffmann
, M.
Horn-von Hoegen
, and K. R.
Hofmann
, ESSDERC 1999, Proceedings of the 29th European Solid-State Device Research Conference
, 13–15 September 1999, Leuven, Belgium (Editions Frontieres
, Neuilly sur Seine, France, 1999
), pp. 300
–303
.15.
M.
Copel
, M. C.
Reuter
, E.
Kaxiras
, and R. M.
Tromp
, Phys. Rev. Lett.
63
, 632
(1989
).16.
H. J.
Osten
, J.
Klatt
, G.
Lippert
, E.
Bugiel
, and S.
Hinrich
, Appl. Phys. Lett.
60
, 2522
(1992
).17.
M. C.
Thornton
, A. A.
Williams
, J. E.
MacDonald
, R. G.
van Silfhout
, M. S.
Finney
, and C.
Norris
, Surf. Sci.
273
, 1
(1992
).18.
19.
J. E.
Ayers
, J. Cryst. Growth
135
, 71
(1994
).20.
M.
Dornheim
and H.
Teichler
, Phys. Status Solidi A
171
, 267
(1999
).21.
E. P.
Kvam
, D. M.
Mahler
, and C. J.
Humphreys
, J. Mater. Res.
5
, 1900
(1990
).22.
M.
Horn-von Hoegen
, A.
Al-Falou
, H.
Pietsch
, B. H.
Müller
, and M.
Henzler
, Surf. Sci.
298
, 29
(1993
).23.
P.
Zahl
, P.
Kury
, and M.
Horn-von Hoegen
, Appl. Phys. A: Mater. Sci. Process.
69
, 481
(1999
).24.
J.
Tersoff
and F. K.
LeGoues
, Phys. Rev. Lett.
72
, 3570
(1994
).25.
M.
Horn-von Hoegen
, B. H.
Müller
, A.
Al-Falou
, and M.
Henzler
, Phys. Rev. Lett.
71
, 3170
(1993
).26.
D. E.
Jesson
, S. J.
Pennycook
, J.-M.
Baribeau
, and D. C.
Houghton
, Phys. Rev. Lett.
71
, 1744
(1993
).27.
M.
Albrecht
, S.
Christiansen
, H. P.
Strunk
, P. O.
Hansson
, and E.
Bauser
, Solid State Phenom.
32–33
, 433
(1993
).28.
D. J.
Eaglesham
and M.
Cerullo
, Appl. Phys. Lett.
58
, 2276
(1991
).29.
A.
Sakai
, N.
Taoka
, O.
Nakatsuka
, S.
Zaima
, and Y.
Yasuda
, Appl. Phys. Lett.
86
, 221916
(2005
).© 2005 American Institute of Physics.
2005
American Institute of Physics
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