Fully relaxed, high-quality Ge layers were grown directly on Si(001) substrates by surfactant-mediated epitaxy at high temperature with large Sb flux. We attribute the low dislocation densities in our films to an abrupt strain relief via the formation of a regular array of 90° dislocations at the interface during the initial, microrough stage of growth. This mechanism of abrupt strain relaxation occurs exclusively under high Sb coverage at temperatures 700°C. The high growth temperature also enhances Sb segregation leading to a low background doping level of only (34×1016)cm3. Thus, we regard surfactant-mediated epitaxy of relaxed Ge on Si(001) as a promising candidate for device application.

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