We present cross-sectional atomic-force-microscope measurements of buried self-assembled quantum dots. The used method needs a minimum of time and sample preparation (cleaving and etching) to obtain the dot density, dot distribution, and give an estimate of the dot dimensions. Etching only the cleaved surface of the sample opens up the opportunity to determine the properties of a buried dot layer before or even after device fabrication.

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We performed TEM measurements in addition to our etch measurements of an unrotated dot sample to validate the quality of our technique. From the TEM measurements we got a baseline extent d1=(31±8.6)nm and a dot height h1=(6±1.5)nm. The etch measurements resulted in a baseline extent d2=(32±5)nm and a dot height h2=(5±2)nm. This shows the suitability of the described etch technique to estimate the QD dimensions.

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