This Letter reports the nickel-silicide phase effects on the electrical characteristics of high-k and silicon dioxide (SiO2) metal-oxide-semiconductor devices. It was found that the silicon-deficient nickel-silicided gate electrode on the hafnium silicon oxynitride (HfSiON) led to a positive flatband voltage (Vfb) shift and a reduction in the equivalent oxide thickness (EOT). However, negligible Vfb shift and EOT decrease were observed in the case of control hafnium oxide and SiO2 structures. It was believed that Si dissociation from the HfSiON layer was the main reason for the positive Vfb shift and the EOT decrease.

1.
M.
Koike
,
T.
Ino
,
Y.
Kamimuta
,
M.
Koyama
,
Y.
Kamata
,
M.
Suzuki
,
Y.
Mitani
,
A.
Nishiyama
, and
Y.
Tsunashima
, in
IEDM Tech. Dig.
,
2003
(unpublished).
2.
J. C.
Lee
,
H.-J.
Choi
,
C. S.
Kang
,
S. J.
Rhee
,
Y. H.
Kim
,
C. Y.
Kang
,
C. H.
Choi
, and
M.
Akbar
, in
IEDM Tech. Dig.
,
2003
(unpublished).
3.
C. S.
Kang
,
H.-J.
Cho
,
R.
Choi
,
Y. H.
Kim
,
C. Y.
Kang
,
S. J.
Rhee
,
C.
Choi
,
M.
Akbar
, and
J. C.
Lee
,
IEEE Trans. Electron Devices
51
,
220
(
2004
).
4.
C.
Hobbs
,
L.
Fonseca
,
V.
Dhandapani
,
S.
Samvedam
,
B.
Taylor
,
J.
Grant
,
L.
Dip
,
D.
Triyoso
,
R.
Hedge
,
D.
Gilmer
,
R.
Gracia
,
D.
Roan
,
L.
Lovejoy
,
R.
Rai
,
L.
Herbert
,
H.
Tseng
,
B.
White
, and
P.
Tobin
, in
VLSI Tech. Dig.
,
2003
(unpublished).
5.
J. H.
Sim
,
H. C.
Wen
,
J. P.
Lu
, and
D. L.
Kwon
,
IEEE Electron Device Lett.
24
,
631
(
2003
).
6.
J.
Kedzierski
,
D.
Boyd
,
P.
Ronsheim
,
S.
Zafar
,
J.
Newbury
,
J.
Ott
,
C.
Cabral
,
J. M.
Leong
, and
W.
Haensch
, in
IEDM Tech. Dig.
,
2003
(unpublished).
7.
J. R.
Hauser
and
K.
Ahmed
, Characterization Metrology ULSI Technology, p.
235
,
1998
.
8.
T.
Lijima
,
A.
Nishiyama
,
Y.
Ushiku
,
T.
Ohguro
,
I.
Kunishima
,
K.
Suguro
, and
H.
Iwai
,
VLSI Tech. Dig.
, (
1992
), p.
70
.
9.
S.
Wolf
, in
Silicon Processing for the VLSI Era
(
Lattice
, California,
1990
), Vol.
2
.
You do not currently have access to this content.