Control of the electrical and adhesion properties of metal/organic interfaces with self-assembled monolayers Available to Purchase

With the aim of improving the electrical and adhesion properties of a noble-metal electrode (Ag)/organic interface, a SH-terminated self-assembled monolayer (SAM) that reacts with the silver atoms of the electrode was tested. Silver atoms deposited on the SH-modified surface were found to bind strongly to the terminal sulfur atoms as a result of the reaction between sulfur and silver. In contrast, silver atoms deposited onto a $CH3$-modified surface do not react with the SAM. The specific contact resistance of the interface between the SH-terminated surface and the silver electrode $(1.31×10−2Ωcm2)$ was found to be much lower than that of the silver thin film deposited on the $CH3$-modified surface $(495.58Ωcm2)$⁠.