A scaleable and site-specific patterning approach with individual addressability is demonstrated via an electropolymerization process within the gap of electrodes. The method can pattern conducting polymer structures by applying a bias between desired electrodes in a monomer vapor. The reaction is proposed to happen in a thin water film condensed inside the electrode gap at ambient environment. It is possible to pattern different conducting polymers on the same substrate by exposing to different monomers. Proof-of-concept experiments on pyrrole and thiophene have shown the generality of this simple and robust method, which enables the real-time monitoring of the resistance and deposition of the conducting polymers. Finally, chemical sensing of the patterned polypyrrole structures to ethanol vapor and ammonia gas are presented.
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2 February 2004
Research Article|
February 02 2004
Individually addressed large-scale patterning of conducting polymers by localized electric fields
Ming Su;
Ming Su
Department of Materials Science and Engineering, Institute for Nanotechnology, Northwestern University, Evanston, Illinois 60208
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Lei Fu;
Lei Fu
Department of Materials Science and Engineering, Institute for Nanotechnology, Northwestern University, Evanston, Illinois 60208
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Nianqiang Wu;
Nianqiang Wu
Department of Materials Science and Engineering, Institute for Nanotechnology, Northwestern University, Evanston, Illinois 60208
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Mohammed Aslam;
Mohammed Aslam
Department of Materials Science and Engineering, Institute for Nanotechnology, Northwestern University, Evanston, Illinois 60208
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Vinayak P. Dravid
Vinayak P. Dravid
Department of Materials Science and Engineering, Institute for Nanotechnology, Northwestern University, Evanston, Illinois 60208
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Appl. Phys. Lett. 84, 828–830 (2004)
Article history
Received:
October 27 2003
Accepted:
December 11 2003
Citation
Ming Su, Lei Fu, Nianqiang Wu, Mohammed Aslam, Vinayak P. Dravid; Individually addressed large-scale patterning of conducting polymers by localized electric fields. Appl. Phys. Lett. 2 February 2004; 84 (5): 828–830. https://doi.org/10.1063/1.1645323
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