Fractal analysis of the surface topography is used to study the effects of hydrogen dilution on the surface transport kinetics during the plasma deposition of hydrogenated amorphous silicon. Images obtained from atomic force microscopy are examined using dimensional fractal analysis, and surface diffusion lengths of growth precursors are estimated from the measured correlation lengths. The addition of small amounts of hydrogen ratios <10/1) during deposition leads to a decrease in the diffusion length, but larger hydrogen dilutions result in increased diffusion length. Moreover, the measured surface diffusion activation barrier is reduced from 0.20 eV for deposition from pure to 0.13 eV with high hydrogen dilution. Results are consistent with recent models for precursor surface transport during low-temperature deposition, and give insight into critical processes for low-temperature silicon crystallization.
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1 April 2002
Research Article|
April 01 2002
Effect of hydrogen on adsorbed precursor diffusion kinetics during hydrogenated amorphous silicon deposition Available to Purchase
K. R. Bray;
K. R. Bray
Department of Chemical Engineering, North Carolina State University, Raleigh, North Carolina 27695
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A. Gupta;
A. Gupta
Department of Chemical Engineering, North Carolina State University, Raleigh, North Carolina 27695
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G. N. Parsons
G. N. Parsons
Department of Chemical Engineering, North Carolina State University, Raleigh, North Carolina 27695
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K. R. Bray
Department of Chemical Engineering, North Carolina State University, Raleigh, North Carolina 27695
A. Gupta
Department of Chemical Engineering, North Carolina State University, Raleigh, North Carolina 27695
G. N. Parsons
Department of Chemical Engineering, North Carolina State University, Raleigh, North Carolina 27695
Appl. Phys. Lett. 80, 2356–2358 (2002)
Article history
Received:
December 12 2001
Accepted:
February 11 2002
Citation
K. R. Bray, A. Gupta, G. N. Parsons; Effect of hydrogen on adsorbed precursor diffusion kinetics during hydrogenated amorphous silicon deposition. Appl. Phys. Lett. 1 April 2002; 80 (13): 2356–2358. https://doi.org/10.1063/1.1467616
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