Monochromatic x-ray photoelectron spectroscopy, time-of-flight secondary ion mass spectrometry, and Rutherford backscattering spectrometry are used to study the outdiffusion of Zr from the alternate gate dielectric candidate thin films deposited on Si(100). We find that Zr incorporation into Si from appears to occur at annealing temperatures higher than 1000 °C. Incorporation of Zr to depths of up to 23 nm into the silicon substrate is observed. A diffusion coefficient of is estimated from the associated depth profiles.
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© 2001 American Institute of Physics.
2001
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