We report an all-additive patterning technique, liquid embossing, in which a thin liquid film is embossed by an elastomeric stamp. We show that, for sufficiently thin films, isolated features are produced as the stamp contacts the underlying substrate, and that the liquid remains patterned even after removal of the stamp. Such an approach enables the rapid patterning of inorganic nanocrystal solutions, as capping groups and solvents can volatilize efficiently at the exposed liquid surface. Using this technique, we have fabricated all-printed all-inorganic transistors, photodetectors, and resistors, as well as multilayer structures with sacrificial layers and vias. Such an approach may enable a route to all-printed inorganic semiconductor logic and machines.
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3 September 2001
Research Article|
September 03 2001
All-additive fabrication of inorganic logic elements by liquid embossing
Colin A. Bulthaup;
Colin A. Bulthaup
Media Lab, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139
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Eric J. Wilhelm;
Eric J. Wilhelm
Media Lab, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139
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Brian N. Hubert;
Brian N. Hubert
Media Lab, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139
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Brent A. Ridley;
Brent A. Ridley
Media Lab, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139
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Joseph M. Jacobson
Joseph M. Jacobson
Media Lab, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139
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Appl. Phys. Lett. 79, 1525–1527 (2001)
Article history
Received:
January 03 2001
Accepted:
May 11 2001
Citation
Colin A. Bulthaup, Eric J. Wilhelm, Brian N. Hubert, Brent A. Ridley, Joseph M. Jacobson; All-additive fabrication of inorganic logic elements by liquid embossing. Appl. Phys. Lett. 3 September 2001; 79 (10): 1525–1527. https://doi.org/10.1063/1.1383269
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