Compliant effect of low-temperature Si buffer for SiGe growth Available to Purchase

Relaxed SiGe attracted much interest due to the applications for strained Si/SiGe high electron mobility transistor, metal-oxide-semiconductor field-effect transistor, heterojunction bipolar transistor, and other devices. High-quality relaxed SiGe templates, especially those with a low threading dislocation density and smooth surface, are critical for device performance. In this work, SiGe films on low-temperature Si buffer layers were grown by solid-source molecular-beam epitaxy and characterized by atomic force microscope, double-axis x-ray diffraction, and photoluminescence spectroscopy. It was demonstrated that, with the proper growth temperature and Si buffer thickness, the low-temperature Si buffer became tensily strained and reduced the lattice mismatch between the SiGe and the Si buffer layer. This performance is similar to that of the compliant substrate: a thin substrate that shares the mismatch strain in heteroepitaxy. Due to the smaller mismatch, misfit dislocation and threading dislocation densities were lower.