We have found that fracture of silicon wafer specimens without introduced flaws takes place with the ejection of many small particles that emit infrared radiation, which has been imaged with a sensitive CCD camera. The particles are of order micron dimensions, preventing surface-barrier separation of carriers excited by the bond breaking at cleavage. Furthermore, larger ejected particles can subsequently crack, allowing further ejection of small luminescent particles. The results show that a simple theory of spread of a pre-existing flaw can be a serious oversimplification of complex phenomena occurring at the onset of brittle cleavage.
REFERENCES
1.
D. R. Clarke, in The Mechanical Properties of Semiconductors, Vol. 37 of “Semiconductors and Semimetals,” edited by K. T. Faber and K. Malloy (Academic, New York, 1992), Chap. 2, p. 79.
2.
B. R. Lawn, Fracture of Brittle Solids (Cambridge University Press, Cambridge, 1993).
3.
4.
5.
D.
Haneman
, N. S.
McAlpine
, E.
Busch
, and C.
Kaalund
, Appl. Surf. Sci.
92
, 484
(1996
).6.
D. G.
Li
, N. S.
McAlpine
, and D.
Haneman
, Surf. Sci.
303
, 171
(1994
).7.
8.
H.
Tokumoto
, S.
Wakiyama
, K.
Miki
, H.
Murakami
, S.
Okayama
, and K.
Kajimura
, J. Vac. Sci. Technol. B
9
, 695
(1991
).9.
S. M. Sze, Physics of Semiconductors (Wiley, New York, 1981).
10.
A. G.
Cullis
, L. T.
Canham
, and P. D. J.
Calcott
, J. Appl. Phys.
82
, 909
(1997
).11.
12.
J. T.
Dickinson
, L. C.
Jensen
, and S. C.
Langford
, Phys. Rev. Lett.
66
, 2120
(1991
).13.
J. T.
Dickinson
, L. C.
Jensen
, S. C.
Langford
, and J. P.
Hirth
, J. Mater. Res.
6
, 112
(1991
).14.
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© 1998 American Institute of Physics.
1998
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