We have achieved the highest barrier height (0.90 eV) with a Schottky contact scheme of W-B-N/GaAs after rapid thermal annealing (RTA) at 700 °C, and even after the RTA at 900 °C, its barrier height (0.77 eV) is relatively higher than those of W (0.55 eV) and W-N/GaAs Schottky contacts (0.68 eV). Deep level transient spectroscopy and carrier density profile measurements show that the higher barrier height and lower leakage current of the W-B-N/GaAs diode are due to the W-B-N film that suppresses changes of the surface carrier and EL2 trap concentrations after the RTA.
REFERENCES
1.
2.
H. Kawasaki, M. Wada, Y. Hida, C. Takano, and J. Kasahara, 1990 IEEE GaAs IC Symposium Technical Digest (IEEE, Piscataway, NJ, 1990) p. 135.
3.
4.
5.
6.
Y. T.
Kim
, D. J.
Kim
, J. W.
Park
, and C. W.
Lee
, Proc. SPIE
3214
, 48
(1997
).7.
J.
Lagowski
, H. C.
Gatos
, J. M.
Parsey
, K.
Wada
, M.
Kaminska
, and W.
Walukiewicz
, Appl. Phys. Lett.
40
, 342
(1982
).8.
H. Y.
Cho
, E. K.
Kim
, S.-K.
Min
, K. J.
Chang
, and C.
Lee
, Appl. Phys. Lett.
58
, 29
(1991
).
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© 1998 American Institute of Physics.
1998
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