Controlled slow‐speed microcutting tests were made on single crystal silicon. Micro‐Raman spectroscopy confirmed the presence of amorphous silicon within the microcutting grooves as well as in the debris particles removed from the grooves. These results indicate that pressure‐induced transformation to metallic silicon can occur during microcutting and the ductile metallic phase will facilitate the cutting process. Raman spectroscopy further indicated the presence of large residual tensile strains in some areas of the microcutting grooves.

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