A nanoimprint process that presses a mold into a thin thermoplastic polymer film on a substrate to create vias and trenches with a minimum size of 25 nm and a depth of 100 nm in the polymer has been demonstrated. Furthermore, the imprint process has been used as a lithography process to fabricate sub‐25 nm diameter metal dot arrays of a 100 nm period in a lift‐off process. It was found that the nanostructures imprinted in the polymers conform completely with the geometry of the mold. At present, the imprinted size is limited by the size of the mold being used; with a suitable mold, the imprint process should mold sub‐10 nm structures with a high aspect ratio in polymers. The nanoimprint process offers a low cost method for mass producing sub‐25 nm structures and has the potential to become a key nanolithography method for future manufacturing of integrated circuits and integrated optics.
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20 November 1995
Research Article|
November 20 1995
Imprint of sub‐25 nm vias and trenches in polymers
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APL Classic Papers
Stephen Y. Chou;
Stephen Y. Chou
NanoStructure Laboratory, Department of Electrical Engineering, University of Minnesota, Minneapolis, Minnesota 55455
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Peter R. Krauss;
Peter R. Krauss
NanoStructure Laboratory, Department of Electrical Engineering, University of Minnesota, Minneapolis, Minnesota 55455
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Preston J. Renstrom
Preston J. Renstrom
NanoStructure Laboratory, Department of Electrical Engineering, University of Minnesota, Minneapolis, Minnesota 55455
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Stephen Y. Chou
Peter R. Krauss
Preston J. Renstrom
NanoStructure Laboratory, Department of Electrical Engineering, University of Minnesota, Minneapolis, Minnesota 55455
Appl. Phys. Lett. 67, 3114–3116 (1995)
Article history
Received:
July 17 1995
Accepted:
September 14 1995
Citation
Stephen Y. Chou, Peter R. Krauss, Preston J. Renstrom; Imprint of sub‐25 nm vias and trenches in polymers. Appl. Phys. Lett. 20 November 1995; 67 (21): 3114–3116. https://doi.org/10.1063/1.114851
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