The fracture strength of free‐standing chemically vapor‐deposited diamond films was assessed by four‐point bending. A two‐parameter Weibull analysis was performed on 130 μm thick films resulting in a Weibull modulus of 4.3 and a statistical scaling stress of 626 MPa. The residual stress in films was measured from the free‐standing film curvature to be 384±10 MPa. The fracture surface chemistry was examined using scanning Auger spectroscopy. The fracture did not occur preferentially along grain boundaries.

This content is only available via PDF.
You do not currently have access to this content.