The source‐drain voltage‐current characteristics of a high Tc field‐effect device consisting of a YBa2Cu3O7−x/SrTiO3/Au multilayer structure are measured. Similarities of the VI curves to those of a metal‐oxide‐semiconductor field‐effect transistor (MOSFET) are observed. However, we emphasize that the superconducting channel exhibits significantly lower dissipation in comparison with the inversion layer in a MOSFET. The device has a 50 Å thick YBa2Cu3O7−x channel layer (Tc=43 K) with a high critical current density Jc (5 K) over 1×105 A/cm2. A transconductance of over 0.2 mS/mm and a voltage gain of 0.9 are obtained in the device.

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