A novel phenomenon, leading to the planarization of topologically prominent features, in partially cured BTDA‐alkylated diamine based preimidized photosensitive polyimide films is reported. This phenomenon appears to be related to solvent interdiffusion between two polyimide layers in intimate contact leading to uniform shrinkage of the two layers. A novel approach for the fabrication of high‐density copper/polyimide multichip interconnect structures has been developed based on the observed planarization phenomenon.

Topics
Polymers
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© 1992 American Institute of Physics.
1992
American Institute of Physics
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