We have developed a novel rapid thermal processor to perform annealing of ion‐implanted GaAs in a trimethylarsenic overpressure. This has allowed study of arsenic ambient annealing in a time/temperature regime not accessible with an arsine furnace. We have compared Si implant activation efficiency and surface degradation for arsenic ambient and proximity capped anneals. The arsenic ambient gives consistently higher activation efficiency with better surfaces.

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