Compositing negative-thermal-expansion materials with Al is an effective strategy for obtaining light zero-thermal-expansion (ZTE) materials. However, the dimensional stability of those composites is not guaranteed due to the residual stress generated during fabrication and the microstructure instability of the matrix. Here, we studied the effects of heat treatments on the dimensional stability of ZTE Cu2P2O7/ZL101 composite (with 32 vol. % of ZL101) prepared using the pressure infiltration method. Compared with the as-cast case, after a certain heat treatment (water quenching after holding at 773 K for 1 h, then aging at 463 K for 8 h, and finally thermal-cold cycling between 463 and 77 K for three times), the dimensional stability was improved by a factor of 20 and the coefficient of thermal expansion (CTE) was highly reproducible in the subsequent temperature cycles test. The treated composite exhibits a CTE of −0.028 ppm/K at 240–305 K and a relatively high thermal conductivity of 29.5 W m−1 K−1 at room temperature, leading to a thermal distortion parameter well less than those of other ZTE materials. The improved dimensional stability and the CTE reproducibility can be attributed to the stabilization of matrix microstructure and the greatly relaxed residual stress as revealed by the analysis of 2θ-sin2ψ based on x-ray diffraction.
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17 March 2025
Research Article|
March 20 2025
Improved dimensional stability of zero-thermal-expansion Cu2P2O7/ZL101 composite by thermal treatment
Jiawei Zeng
;
Jiawei Zeng
(Conceptualization, Data curation, Formal analysis, Investigation, Methodology, Writing – original draft, Writing – review & editing)
1
University of Science and Technology of China
, Hefei 230026, China
2
Key Laboratory of Materials Physics, Institute of Solid State Physics, HFIPS, Chinese Academy of Sciences
, Hefei 230031, China
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Chenlong Wei;
Chenlong Wei
(Conceptualization, Writing – review & editing)
3
School of Electronic Engineering and Intelligent Manufacturing, Anqing Normal University
, Anqing 246133, China
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Guanyin Gao
;
Guanyin Gao
a)
(Software, Supervision)
1
University of Science and Technology of China
, Hefei 230026, China
4
Hefei National Laboratory for Physical Sciences at Microscale, University of Science and Technology of China
, Hefei 230026, China
a)Authors to whom correspondence should be addressed: [email protected]; [email protected]; and [email protected]
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Yanwei Ding;
Yanwei Ding
(Methodology, Software)
1
University of Science and Technology of China
, Hefei 230026, China
4
Hefei National Laboratory for Physical Sciences at Microscale, University of Science and Technology of China
, Hefei 230026, China
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Yuxia Bai;
Yuxia Bai
(Methodology, Software)
1
University of Science and Technology of China
, Hefei 230026, China
4
Hefei National Laboratory for Physical Sciences at Microscale, University of Science and Technology of China
, Hefei 230026, China
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Jianchao Lin
;
Jianchao Lin
a)
(Conceptualization)
1
University of Science and Technology of China
, Hefei 230026, China
2
Key Laboratory of Materials Physics, Institute of Solid State Physics, HFIPS, Chinese Academy of Sciences
, Hefei 230031, China
a)Authors to whom correspondence should be addressed: [email protected]; [email protected]; and [email protected]
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Buke Dong;
Buke Dong
(Validation)
1
University of Science and Technology of China
, Hefei 230026, China
2
Key Laboratory of Materials Physics, Institute of Solid State Physics, HFIPS, Chinese Academy of Sciences
, Hefei 230031, China
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Wenhai Song
;
Wenhai Song
(Resources)
2
Key Laboratory of Materials Physics, Institute of Solid State Physics, HFIPS, Chinese Academy of Sciences
, Hefei 230031, China
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Peng Tong
;
Peng Tong
a)
(Conceptualization, Funding acquisition, Writing – original draft, Writing – review & editing)
1
University of Science and Technology of China
, Hefei 230026, China
2
Key Laboratory of Materials Physics, Institute of Solid State Physics, HFIPS, Chinese Academy of Sciences
, Hefei 230031, China
a)Authors to whom correspondence should be addressed: [email protected]; [email protected]; and [email protected]
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Yuping Sun
Yuping Sun
(Conceptualization, Supervision)
2
Key Laboratory of Materials Physics, Institute of Solid State Physics, HFIPS, Chinese Academy of Sciences
, Hefei 230031, China
5
Anhui Province Key Laboratory of Condensed Matter Physics at Extreme Conditions, High Magnetic Field Laboratory, HFIPS, Chinese Academy of Sciences
, Hefei, 230031, China
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Jiawei Zeng
1,2
Chenlong Wei
3
Guanyin Gao
1,4,a)
Yanwei Ding
1,4
Yuxia Bai
1,4
Jianchao Lin
1,2,a)
Buke Dong
1,2
Wenhai Song
2
Peng Tong
1,2,a)
Yuping Sun
2,5
1
University of Science and Technology of China
, Hefei 230026, China
2
Key Laboratory of Materials Physics, Institute of Solid State Physics, HFIPS, Chinese Academy of Sciences
, Hefei 230031, China
3
School of Electronic Engineering and Intelligent Manufacturing, Anqing Normal University
, Anqing 246133, China
4
Hefei National Laboratory for Physical Sciences at Microscale, University of Science and Technology of China
, Hefei 230026, China
5
Anhui Province Key Laboratory of Condensed Matter Physics at Extreme Conditions, High Magnetic Field Laboratory, HFIPS, Chinese Academy of Sciences
, Hefei, 230031, China
a)Authors to whom correspondence should be addressed: [email protected]; [email protected]; and [email protected]
Appl. Phys. Lett. 126, 111907 (2025)
Article history
Received:
December 21 2024
Accepted:
February 23 2025
Citation
Jiawei Zeng, Chenlong Wei, Guanyin Gao, Yanwei Ding, Yuxia Bai, Jianchao Lin, Buke Dong, Wenhai Song, Peng Tong, Yuping Sun; Improved dimensional stability of zero-thermal-expansion Cu2P2O7/ZL101 composite by thermal treatment. Appl. Phys. Lett. 17 March 2025; 126 (11): 111907. https://doi.org/10.1063/5.0254207
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