In this Letter, we propose an approach to improve the packaging of electro-optical transceivers based on silicon photonics through the development of a glass interposer. This assembly platform integrates polymer optical waveguides and an integrated turning mirror that vertically redirect the optical signal in the plane of the interposer to the grating coupler of a flip-chipped photonic integrated circuit (PIC). A distinctive feature of the proposed packaging scheme is to use a conventional flip-chip technique without active alignment. Functionalities are completed with a copper redistribution layer that supports the routing of DC to millimeter wave (mmW) signals to drive the PIC. The measured loss in polymer waveguides is 1.92 dB/cm at 1310 nm, and the coupling losses associated with light propagation through the turning mirror and the PIC grating coupler are 18.7 dB. Coplanar mmW waveguides are structured on the glass interposer by cold laser ablation, yielding an attenuation of 0.3 dB/mm at 58 GHz. The most important outcome of this work is that the coupling of the optical signal from the interposer to the PIC is experimentally established. We also assessed the mmW performance of coplanar waveguides through the validation of the interposer to PIC and PIC to the interposer transition.
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29 July 2024
Research Article|
July 29 2024
Glass interposer for heterogeneous integration of flip-chipped photonic and electronic integrated circuits
Jean-Marc Boucaud
;
Jean-Marc Boucaud
(Conceptualization, Data curation, Formal analysis, Investigation, Methodology, Writing – original draft)
1
STMicroelectronics
, 850 rue Jean Monnet, F-38920 Crolles, France
2
University Lille, CNRS, Centrale Lille, Junia, University Poluytechnique Haut-de-France, UMR 8520 IEMN – Institut d'Electronique de Microélectronique et de Nanotechnologie
, F-59000 Lille, France
3
CROMA, Université de Grenoble Alpes, UMR 5130 CNRS, Minatec-Grenoble-INP
, CS 50257, 38016 Grenoble, France
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Cédric Durand
;
Cédric Durand
(Conceptualization, Methodology, Supervision, Validation, Writing – original draft)
1
STMicroelectronics
, 850 rue Jean Monnet, F-38920 Crolles, France
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Frédéric Gianesello;
Frédéric Gianesello
(Conceptualization, Methodology, Supervision, Validation)
1
STMicroelectronics
, 850 rue Jean Monnet, F-38920 Crolles, France
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Davide Bucci
;
Davide Bucci
(Conceptualization, Formal analysis, Methodology, Supervision, Writing – review & editing)
3
CROMA, Université de Grenoble Alpes, UMR 5130 CNRS, Minatec-Grenoble-INP
, CS 50257, 38016 Grenoble, France
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Jean-Emmanuel Broquin
;
Jean-Emmanuel Broquin
(Conceptualization, Formal analysis, Resources, Supervision, Validation)
3
CROMA, Université de Grenoble Alpes, UMR 5130 CNRS, Minatec-Grenoble-INP
, CS 50257, 38016 Grenoble, France
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Emmanuel Dubois
Emmanuel Dubois
a)
(Conceptualization, Formal analysis, Funding acquisition, Investigation, Methodology, Project administration, Resources, Supervision, Validation, Writing – original draft, Writing – review & editing)
2
University Lille, CNRS, Centrale Lille, Junia, University Poluytechnique Haut-de-France, UMR 8520 IEMN – Institut d'Electronique de Microélectronique et de Nanotechnologie
, F-59000 Lille, France
a)Author to whom correspondence should be addressed: [email protected]
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a)Author to whom correspondence should be addressed: [email protected]
Appl. Phys. Lett. 125, 054101 (2024)
Article history
Received:
May 31 2024
Accepted:
July 17 2024
Citation
Jean-Marc Boucaud, Cédric Durand, Frédéric Gianesello, Davide Bucci, Jean-Emmanuel Broquin, Emmanuel Dubois; Glass interposer for heterogeneous integration of flip-chipped photonic and electronic integrated circuits. Appl. Phys. Lett. 29 July 2024; 125 (5): 054101. https://doi.org/10.1063/5.0221309
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