In this study, a facile and effective approach for the preparation of Cu2O/ZnO heterostructures on flexible carbon materials to enhance the piezoelectric performance is reported. The Cu2O/ZnO heterostructures are deposited directly on carbon fibers (CFs) by a two-step method using plasma–liquid interaction strategy. The Cu2O microparticles are first deposited on the surface of CFs, and then, the ZnO nanostructures are grown on the surface of Cu2O microparticles and CFs. The as-prepared CFs show an improved piezoelectric response of d33 = 7.95 pm/V compared to intrinsic CFs (d33 = 2.64 pm/V), which is based on the nano-heterostructures principle. This work demonstrates a simple and feasible approach to prepare flexible carbon materials with enhanced piezoelectric performance, which may provide an ecologically friendly option for the deposition of semiconductor heterostructures.

1.
Y.
Li
,
J.
Zhang
,
Q.
Chen
,
X.
Xia
, and
M.
Chen
,
Adv. Mater.
33
(
27
),
2100855
(
2021
).
2.
Y. J.
Hong
,
R. K.
Saroj
,
W. I.
Park
, and
G. C.
Yi
,
APL Mater.
9
,
060907
(
2021
).
3.
X.
Zhou
,
B.
Shen
,
A.
Lyubartsev
,
J.
Zhai
, and
N.
Hedin
,
Nano Energy
96
,
107141
(
2022
).
4.
T.
Ozdal
and
H.
Kavak
,
Superlattices Microstruct.
146
,
106679
(
2020
).
5.
B. H.
Park
,
H.
Park
,
T.
Kim
,
S. J.
Yoon
,
Y.
Kim
,
N.
Son
, and
M.
Kang
,
Int. J. Hydrogen Energy
46
(
77
),
38319
(
2021
).
6.
Q.
Wang
,
Y.
Qiu
,
D.
Yang
,
B.
Li
,
X.
Zhang
,
Y.
Tang
, and
L.
Hu
,
Appl. Phys. Lett.
113
,
053901
(
2018
).
7.
J.
Xu
,
S.
Song
,
J.
Li
,
Y.
Ji
,
Z.
Li
,
D.
Fu
,
Z.
Zhong
,
G.
Xu
, and
F.
Su
,
J. Catal.
419
,
99
(
2023
).
8.
R. R.
Kumar
,
W. C.
Yu
,
T.
Murugesan
,
P. C.
Chen
,
A.
Ranjan
,
M. Y.
Lu
, and
H. N.
Lin
,
J. Alloys Compd.
952
,
169984
(
2023
).
9.
X.
Fei
,
D.
Jiang
, and
M.
Zhao
,
J. Lumin.
254
,
119477
(
2023
).
10.
S.
Zhong
,
D.
Xiong
,
B.
Zhang
,
X.
Yang
,
T.
Yang
,
G.
Tian
,
H.
Zhang
,
W.
Yang
, and
W.
Deng
,
ACS Photonics
9
(
1
),
268
(
2022
).
11.
T. T.
Nguyen
,
O. C.
Emeka
,
N.
Kumar
,
P.
Bhatnagar
, and
J.
Kim
,
Mater. Today Commun.
34
,
105205
(
2023
).
12.
L.
Wang
,
X.
Gu
,
L.
Zhao
,
B.
Wang
,
C.
Jia
,
J.
Xu
,
Y.
Zhao
, and
J.
Zhang
,
Electrochim. Acta
295
,
107
(
2019
).
13.
F.
Xue
,
F.
Fan
,
Z.
Zhu
,
Z.
Zhang
,
Y.
Gu
, and
Q.
Li
,
Nanoscale
15
,
6822
(
2023
).
14.
S.
Banerjee
,
E.
Adhikari
,
P.
Sapkota
,
A.
Sebastian
, and
S.
Ptasinska
,
Materials
13
(
13
),
2931
(
2020
).
15.
C.
Xiong
,
Y.
Wang
,
L.
Lin
,
M.
Gao
,
Y.
Huang
, and
P. K.
Chu
,
Surf. Interfaces
37
,
102758
(
2023
).
16.
F.
Rezaei
,
P.
Vanraes
,
A.
Nikiforov
,
R.
Morent
, and
N. D.
Geyter
,
Materials
12
(
17
),
2751
(
2019
).
17.
Z.
Zhong
,
C.
Wang
,
R.
Han
,
M.
Gao
,
Y.
Huang
, and
S.
Ramakrishna
,
Compos. Commun.
38
,
101495
(
2023
).
18.
P. J.
Bruggeman
,
R. R.
Frontiera
,
U. R.
Kortshagen
,
M. J.
Kushner
,
S.
Linic
,
G. C.
Schatz
,
H.
Andaraarachchi
,
S.
Exarhos
,
L. O.
Jones
,
C. M.
Mueller
,
C. C.
Rich
,
C.
Xu
,
Y.
Yue
, and
Y.
Zhang
,
J. Appl. Phys.
129
(
20
),
200902
(
2021
).
19.
P.
Rumbach
and
D. B.
Go
,
Top. Catal.
60
,
799
(
2017
).
20.
D. A.
Shutov
,
A. V.
Sungurova
,
A.
Choukourov
, and
V. V.
Rybkin
,
Plasma Chem. Plasma Process.
36
,
1253
(
2016
).
21.
J.
Liu
,
B.
He
,
X.
Wang
,
Q.
Chen
, and
G.
Yue
,
Eur. Phys. J. D
73
,
11
(
2019
).
22.
T.
Kaneko
and
R.
Hatakeyama
,
Jpn. J. Appl. Phys., Part 1
57
,
0102A6
(
2018
).
23.
T.
Iqbal
,
A.
Aziz
,
M. A.
Khan
,
S.
Andleeb
,
H.
Mahmood
,
A. A.
Khan
,
R.
Khan
, and
M.
Shafique
,
Mater. Sci. Eng., B
228
,
153
(
2018
).
24.
L.
Cheng
,
G.
Wu
,
D.
Ruan
,
H.
Wu
, and
A.
Liu
,
J. Mater. Sci.
58
,
186
(
2023
).
25.
M. C.
Oliveira
,
V. S.
Fonseca
,
N. F.
Andrade Neto
,
R. A. P.
Ribeiro
,
E.
Longo
,
S. R.
de Lazaro
,
F. V.
Motta
, and
M. R. D.
Bomio
,
Ceram. Int.
46
(
7
),
9446
(
2020
).
26.
D.
Xiong
,
W.
Deng
,
G.
Tian
,
Y.
Gao
,
X.
Chu
,
C.
Yan
,
L.
Jin
,
Y.
Su
,
W.
Yan
, and
W.
Yang
,
Nanoscale
11
,
3021
(
2019
).
27.
H.
Zhang
,
G.
Tian
,
D.
Xiong
,
T.
Yang
,
S.
Zhong
,
L.
Jin
,
B.
Lan
,
L.
Deng
,
S.
Wang
,
Y.
Sun
,
W.
Yang
, and
W.
Deng
,
ACS Appl. Mater. Interfaces
14
(
25
),
29061
(
2022
).
28.
N.
Celebi
and
K.
Salimi
,
J. Colloid Interface Sci.
605
,
23
(
2022
).
29.
Y.
Sun
,
X.
Wang
,
Q.
Fu
, and
C.
Pan
,
Appl. Surf. Sci.
564
,
150379
(
2021
).
30.
N. J.
Karazmoudeh
,
M.
Soltanieh
, and
M.
Hasheminiasari
,
J. Alloys Compd.
947
,
169564
(
2023
).
31.
M.
Yang
,
L.
Zhu
,
Y.
Li
,
L.
Cao
, and
Y.
Guo
,
J. Alloys Compd.
578
,
143
(
2013
).
32.
Y.
Calahorra
,
A.
Datta
,
J.
Famelton
,
D.
Kam
,
O.
Shoseyov
, and
S. K.
Narayan
,
Nanoscale
10
,
16812
(
2018
).
33.
H.
Ursic
and
M.
Sadl
,
Appl. Phys. Lett.
121
,
192905
(
2022
).
34.
J.
Xiao
,
T. S.
Herng
,
J.
Ding
, and
K.
Zeng
,
J. Alloys Compd.
709
,
535
(
2017
).
35.
M. C.
Maldonado-Orozco
,
M. T.
Ochoa-Lara
,
J. E.
Sosa-Marquez
,
R. P.
Talamantes-Soto
,
A.
Hurtado-Macias
,
R. L.
Anton
,
J. A.
Gonzalez
,
J. T.
Holguin-Momaca
,
S. F.
Olive-Mendez
, and
F.
Espinosa-Magana
,
J. Am. Ceram. Soc.
102
(
5
),
2800
(
2019
).
36.
Y.
Nie
,
Y.
Qiu
,
D.
Yang
,
X.
Zhang
, and
L.
Hu
,
J. Mater. Sci.
30
,
9466
(
2019
).

Supplementary Material

You do not currently have access to this content.