The continued development of BaTiO3-based multilayer ceramic capacitors has contributed to further miniaturization by reducing the thickness of each dielectric layer for different voltage range components. MLCC designs that achieve higher volumetric capacitive efficiency must be balanced with stable properties over long operational times at higher fields and temperatures, raising concerns about their reliability. To improve the reliability and slow transient mechanisms of oxygen vacancy electromigration that drive the degradation of insulation resistance of MLCCs, we need to develop new models and improved metrologies to enhance the performance of MLCCs. This paper demonstrates how electrical characterization techniques, such as thermally stimulated depolarization current and highly accelerated life test, can be used to better understand MLCCs' degradation and assess their reliability. Also, the limitations of existing lifetime prediction models and their shortcomings of using mean time to failure in predicting the lifetime of MLCCs are discussed along with future perspectives on evaluating the reliability of MLCCs.
References
1.
D.
Liu
, “NASA EEE parts bulletin
,” Technical Report
, Jet Propulsion Laboratory, National Aeronautics and Space Administration
, Pasadena, CA
, 2013
.2.
S. K.
Kurtz
, S.
Levinson
, and D.
Shi
, J. Am. Ceram. Soc.
72
, 2223
(1989
).3.
K.
Hong
, T. H.
Lee
, J. M.
Suh
, S.-H.
Yoon
, and H. W.
Jang
, J. Mater. Chem. C Mater.
7
, 9782
(2019
).4.
K.
Jiang
, L.
Zhang
, B.
Li
, P.
Li
, S.
Yu
, R.
Sun
, Z.
Fu
, and X.
Cao
, Ceram. Int.
48
, 30020
(2022
).5.
A. V.
Polotai
, G.-Y.
Yang
, E. C.
Dickey
, and C. A.
Randall
, J. Am. Ceram. Soc.
90
, 3811
(2007
).6.
G. Y.
Yang
, E. C.
Dickey
, C. A.
Randall
, M. S.
Randall
, and L. A.
Mann
, J. Appl. Phys.
94
, 5990
(2003
).7.
M. M.
Samantaray
, K.
Kaneda
, W.
Qu
, E. C.
Dickey
, and C. A.
Randall
, J. Am. Ceram. Soc.
95
, 992
(2011
).8.
C. A.
Randall
and P.
Yousefian
, J. Eur. Ceram. Soc.
42
, 1445
(2022
).9.
G. Y.
Yang
, E. C.
Dickey
, C. A.
Randall
, D. E.
Barber
, P.
Pinceloup
, M. A.
Henderson
, R. A.
Hill
, J. J.
Beeson
, and D. J.
Skamser
, J. Appl. Phys.
96
, 7492
(2004
).10.
G. Y.
Yang
, G. D.
Lian
, E. C.
Dickey
, C. A.
Randall
, D. E.
Barber
, P.
Pinceloup
, M. A.
Henderson
, R. A.
Hill
, J. J.
Beeson
, and D. J.
Skamser
, J. Appl. Phys.
96
, 7500
(2004
).11.
T.
Sada
and N.
Fujikawa
, Jpn. J. Appl. Phys.
56
, 10PB04
(2017
).12.
J.
Yamamatsu
, N.
Kawano
, T.
Arashi
, A.
Sato
, Y.
Nakano
, and T.
Nomura
, J. Power Sources
60
, 199
(1996
).13.
H.
Saito
, H.
Chazono
, H. K. H.
Kishi
, and N. Y. N.
Yamaoka
, Jpn. J. Appl. Phys.
30
, 2307
(1991
).14.
S.
Trolier-McKinstry
and R. E.
Newnham
, Materials Engineering
(Cambridge University Press
, 2017
).15.
H.
Kishi
, Y.
Mizuno
, and H.
Chazono
, Jpn. J. Appl. Phys., Part 1: Regular Papers Short Notes Rev. Papers
42
, 1
(2003
).16.
S.
Lee
, C. A.
Randall
, and Z. K.
Liu
, J. Am. Ceram. Soc.
91
, 1748
(2008
).17.
N. H.
Chan
, R. K.
Sharma
, and D. M.
Smyth
, J. Am. Ceram. Soc.
65
, 167
(1982
).18.
N. H.
Chan
and D. M.
Smyth
, J. Am. Ceram. Soc.
67
, 285
(2006
).19.
T.
Baiatu
, R.
Waser
, and K.-H.
Hardtl
, J. Am. Ceram. Soc.
73
, 1663
(1990
).20.
R.
Waser
, T.
Baiatu
, and K. H.
Hji
, Mater. Sci. Eng., A
109
, 171
(1989
).21.
P.
Yousefian
and C. A.
Randall
, J. Mater. Sci.
57
, 15913
(2022
).22.
S.-H. H.
Yoon
, S.-H. H.
Kim
, and D.-Y. Y.
Kim
, J. Appl. Phys.
114
, 074102
(2013
).23.
S. H.
Yoon
, J. S.
Park
, S. H.
Kim
, and D. Y.
Kim
, Appl. Phys. Lett.
103
, 042901
(2013
).24.
P.
Bräunlich
, Thermally Stimulated Relaxation in Solids
(Springer, Berlin Heidelberg
, 1979
).25.
A. K.
Jonscher
, J. Phys. D: Appl. Phys.
24
, 1633
(1991
).26.
S.
Takeoka
, K.
Morita
, Y.
Mizuno
, and H.
Kishi
, Ferroelectrics
356
, 78
–84
(2007
).27.
W.
Liu
and C. A.
Randall
, J. Am. Ceram. Soc.
91
, 3251
(2008
).28.
X.
Zhang
, J.
Zhang
, Y.
Zhou
, Z.
Xie
, Z.
Yue
, and L.
Li
, J. Alloys Compd.
662
, 308
(2016
).29.
R. A.
Maier
, Dynamics of Oxygen Vacancies and Defect Complexes in the Pervskite Oxide Structure
(The Pennsylvania State University
, 2014
).30.
W.-E.
Liu
, Impedance/Thermally Stimulated Depolarization Current and Microstructural Relations at Interfaces in Degraded Perovskite Dielectrics
(The Pennsylvania State University
, 2009
).31.
A.
Torres
, J.
Jimenez
, B.
Vega
, and J. A.
de Saja
, Phys. Status Solidi (a)
90
, 749
(1985
).32.
A. K.
Jonscher
, in Universal Relaxation Law: A Sequel to Dielectric Relaxation in Solids
(Chelsea Dielectrics Press
, London
, 1996
).33.
B.
Akkopru‐Akgun
, D. M.
Marincel
, K.
Tsuji
, T. J. M.
Bayer
, C. A.
Randall
, M. T.
Lanagan
, and S.
Trolier‐McKinstry
, J. Am. Ceram. Soc.
104
, 5270
(2021
).34.
J. J. M.
Ramos
and N. T.
Correia
, Thermochim. Acta
426
, 185
(2005
).35.
B.
Dodson
and H.
Schwab
, Accelerated Testing: A Practitioner's Guide to Accelerated and Reliability Testing
(SAE International
, 2006
).36.
A.
Teverovsky
, “Screening techniques for ceramic capacitors guidelines for selection, screening and qualification of low-voltage commercial multilayer ceramic capacitors for space programs guidelines for selection, screening and qualification of low-voltage commercial
,” Technical Report
, Dell Perot Systems
, 2012
.37.
A.
Teverovsky
, in 2017 IEEE International Reliability Physics Symposium (IRPS
), Monterey, California
, 2017
.38.
T.
Sada
, K.
Izawa
, N.
Fujikawa
, and Y.
Fujioka
, Jpn. J. Appl. Phys.
57
, 11UC02
(2018
).39.
D.
Liu
and M. J.
Sampson
, in proceedings of CARTS
, Jacksonville, FL
, 2011
.40.
A.
Hernández-López
, J.
Aguilar-Garib
, S.
Guillemet-Fritsch
, R.
Nava-Quintero
, P.
Dufour
, C.
Tenailleau
, B.
Durand
, and Z.
Valdez-Nava
, Materials
11
, 1900
(2018
).41.
R.
Confer
, J.
Canner
, T.
Trostle
, and S.
Kurtz
, in 41st Electronic Components & Technology Conference
(IEEE
, 1991
), pp. 320
–322
.42.
W.
Kuo
, W.-T. K.
Chien
, and T.
Kim
, Reliability, Yield, and Stress Burn-In
(Springer US
, Boston, MA
, 1998
).43.
C. H.
Lee
and J. R.
Yoon
, J. Ceram. Process. Res.
23
, 794
(2022
).44.
M. S.
Randall
, A. S.
Gurav
, D. J.
Skamser
, and J. J.
Beeson
, in proceedings of CARTS Conference
(Components Technology Institute, Inc
., 2003
), pp. 134
–140
.45.
J.-R.
Yoon
, K.-M.
Lee
, and S.-W.
Lee
, Trans. Electr. Electron. Mater.
10
, 5
(2009
).46.
C. A.
Randall
, R.
Maier
, W.
Qu
, K.
Kobayashi
, K.
Morita
, Y.
Mizuno
, N.
Inoue
, and T.
Oguni
, J. Appl. Phys.
113
, 014101
(2013
).47.
K.
Morita
, T.
Shimura
, S.
Abe
, and Y.
Konishi
, Jpn. J. Appl. Phys.
57
, 11UC03
(2018
).© 2023 Author(s). Published under an exclusive license by AIP Publishing.
2023
Author(s)
You do not currently have access to this content.
