Aluminum air bridges for superconducting quantum devices realized using a single-step electron-beam lithography process

In superconducting quantum devices, air bridges enable increased circuit complexity and density, and mitigate the risk of microwave loss arising from mode mixing. We implement aluminum air bridges using a simple process based on single-step electron-beam gradient exposure. The resulting bridges have sizes ranging from 20 µm to 100 µm, with a yield exceeding 99% for lengths up to 36 µm. When used to connect ground planes in coplanar waveguide resonators, the induced loss contributed to the system is negligible, corresponding to a loss per bridge less than $1.0×10−8$⁠. The bridge process is compatible with Josephson junctions and allows for the simultaneous creation of low loss bandages between superconducting layers.