Due to their unique structures and properties, emerging two-dimensional (2D) materials have been at the frontier of research in, e.g., materials science, physics, and engineering. Three-dimensional (3D) tubular geometry enables 2D materials unparalleled advantages for various applications, for example, wide-angle infrared photodetectors, extremely sensitive molecular sensors, and memory with high density. Furthermore, 3D tubular structures offer a promising integration platform into chips with a broad range of materials, especially 2D materials. In this Perspective, we highlight state-of-the-art methods to assemble/manufacture 2D materials into 3D tubular structures/devices via self-rolled-up or template methods. These tubular 3D devices inspire unique physical, chemical, and mechanical properties for optical microcavity, photodetector, on-chip electronics, and bubble-propelled microengines. On-chip manufacture of 3D tubular structures/devices provides great opportunity and challenge for 2D materials for More than Moore applications such as unconventional electronics, smart sensors, and miniaturized robots.
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8 August 2022
Perspective|
August 12 2022
Progress and challenges on 3D tubular structures and devices of 2D materials

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Binmin Wu
;
Binmin Wu
(Writing – original draft, Writing – review & editing)
1
Department of Materials Science, International Institute of Intelligent Nanorobots and Nanosystems, State Key Laboratory of ASIC and Systems, Fudan University
, Shanghai 200433, People's Republic of China
2
School of Microelectronics, Fudan University
, Shanghai 200433, People's Republic of China
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Ziyu Zhang
;
Ziyu Zhang
(Writing – review & editing)
1
Department of Materials Science, International Institute of Intelligent Nanorobots and Nanosystems, State Key Laboratory of ASIC and Systems, Fudan University
, Shanghai 200433, People's Republic of China
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Chao Wang
;
Chao Wang
(Writing – review & editing)
1
Department of Materials Science, International Institute of Intelligent Nanorobots and Nanosystems, State Key Laboratory of ASIC and Systems, Fudan University
, Shanghai 200433, People's Republic of China
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Enming Song;
Enming Song
(Writing – review & editing)
3
Shanghai Frontiers Science Research Base of Intelligent Optoelectronics and Perception, Institute of Optoelectronics, Fudan University
, Shanghai 200433, People's Republic of China
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Jizhai Cui;
Jizhai Cui
(Writing – review & editing)
1
Department of Materials Science, International Institute of Intelligent Nanorobots and Nanosystems, State Key Laboratory of ASIC and Systems, Fudan University
, Shanghai 200433, People's Republic of China
4
Yiwu Research Institute of Fudan University
, Yiwu, Zhejiang 322000, People's Republic of China
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Gaoshan Huang
;
Gaoshan Huang
(Writing – review & editing)
1
Department of Materials Science, International Institute of Intelligent Nanorobots and Nanosystems, State Key Laboratory of ASIC and Systems, Fudan University
, Shanghai 200433, People's Republic of China
4
Yiwu Research Institute of Fudan University
, Yiwu, Zhejiang 322000, People's Republic of China
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Peng Zhou
;
Peng Zhou
(Writing – review & editing)
2
School of Microelectronics, Fudan University
, Shanghai 200433, People's Republic of China
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Zengfeng Di
;
Zengfeng Di
(Writing – review & editing)
5
State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences
, Shanghai 200050, People's Republic of China
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Yongfeng Mei
Yongfeng Mei
a)
(Supervision, Validation, Visualization, Writing – original draft, Writing – review & editing)
1
Department of Materials Science, International Institute of Intelligent Nanorobots and Nanosystems, State Key Laboratory of ASIC and Systems, Fudan University
, Shanghai 200433, People's Republic of China
3
Shanghai Frontiers Science Research Base of Intelligent Optoelectronics and Perception, Institute of Optoelectronics, Fudan University
, Shanghai 200433, People's Republic of China
4
Yiwu Research Institute of Fudan University
, Yiwu, Zhejiang 322000, People's Republic of China
a)Author to whom correspondence should be addressed: Email: [email protected]
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Binmin Wu
1,2
Ziyu Zhang
1
Chao Wang
1
Enming Song
3
Jizhai Cui
1,4
Gaoshan Huang
1,4
Peng Zhou
2
Zengfeng Di
5
Yongfeng Mei
1,3,4,a)
1
Department of Materials Science, International Institute of Intelligent Nanorobots and Nanosystems, State Key Laboratory of ASIC and Systems, Fudan University
, Shanghai 200433, People's Republic of China
2
School of Microelectronics, Fudan University
, Shanghai 200433, People's Republic of China
3
Shanghai Frontiers Science Research Base of Intelligent Optoelectronics and Perception, Institute of Optoelectronics, Fudan University
, Shanghai 200433, People's Republic of China
4
Yiwu Research Institute of Fudan University
, Yiwu, Zhejiang 322000, People's Republic of China
5
State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences
, Shanghai 200050, People's Republic of China
a)Author to whom correspondence should be addressed: Email: [email protected]
Appl. Phys. Lett. 121, 060503 (2022)
Article history
Received:
May 12 2022
Accepted:
July 21 2022
Citation
Binmin Wu, Ziyu Zhang, Chao Wang, Enming Song, Jizhai Cui, Gaoshan Huang, Peng Zhou, Zengfeng Di, Yongfeng Mei; Progress and challenges on 3D tubular structures and devices of 2D materials. Appl. Phys. Lett. 8 August 2022; 121 (6): 060503. https://doi.org/10.1063/5.0098838
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